Wireless Device Antenna Manufacturing with Sensor Integration
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Solution Overview
Problem
The cost of manufacturing wireless devices with integrated antennas is high due to the need for semiconductor techniques that fabricate antennas on the same substrate as other components, limiting the reduction of costs in roll-to-roll manufacturing processes.
Innovation Solution
A method involving roll-to-roll manufacturing where antennas with conductive loops are placed on a plastic layer, with sensor chips interconnected to the antennas and encapsulated, allowing for modular assembly and reducing high-temperature processing on the plastic substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If semiconductor techniques are used to fabricate antennas on the same substrate as other components, then integration is improved, but manufacturing cost increases
Solution Approach 1:
The patent divides the wireless device into separate modules: antennas are placed on a plastic layer while sensor chips are mounted separately and interconnected to the antennas. This segmentation allows each component to be manufactured using optimal techniques independently, avoiding the need for expensive semiconductor fabrication of entire integrated systems.
Solution Approach 2:
The plastic layer serves as an intermediary substrate that carries both the antennas and sensor chips. This mediator enables modular assembly where components can be placed and interconnected on the plastic layer without requiring high-temperature semiconductor processing, thus reducing manufacturing costs while maintaining integration.
2Productivity
If roll-to-roll manufacturing is used, then productivity is improved, but high-temperature processing requirements worsen compatibility with plastic substrates
Solution Approach 1:
The antennas are pre-fabricated on the plastic layer using low-temperature techniques before the plastic substrate undergoes any high-temperature processing. Sensor chips are also prepared separately with their interconnections. This preliminary preparation allows the final assembly to occur on the plastic layer without exposing it to temperatures that would damage the plastic material, enabling roll-to-roll manufacturing.
3Ease of manufacture
If modular assembly with pick-and-place robots is used, then manufacturing cost is reduced, but manufacturing precision may worsen
Solution Approach 1:
The patent replaces manual or high-precision mechanical assembly with automated pick-and-place robots that use computer-controlled positioning and vision systems. This mechanical substitution maintains high placement precision through automation while reducing labor costs and enabling scalable production.
Data Source
AI summary
A manufacturing method for a wireless device may involve placing a plurality of antennas on a plastic layer, wherein each of the antennas comprises one or more conductive loops positioned within an inner diameter and an outer diameter; placing a plurality of sensor chips on the plastic layer such that each sensor chip is interconnected to a respective antenna on the plastic layer and is positioned within the inner diameter and outer diameter of the respective antenna, wherein each sensor chip has a respective sensor facing away from the plastic layer and has respective electrical contacts interconnected with the respective antenna; and providing an encapsulation layer over the plurality of antennas and the plurality of sensor chips on the plastic layer.