Wireless Apparatus Antenna Placement for Wiring Freedom
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Solution Overview
Problem
The use of solder balls for forming antenna elements in semiconductor packages reduces the number of available pins for connections, limiting the degree of freedom in wiring due to increased grounding requirements or package size when trying to maintain sufficient pins.
Innovation Solution
The antenna's main radiating part is positioned outside the regions defined by the package terminals on the board, reducing induced currents in the terminals and allowing for a higher number of usable pins without degrading antenna characteristics, thus enhancing wiring flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If solder balls are used to form antenna elements in semiconductor packages, then the volume of the wireless apparatus is reduced and manufacturing cost is lowered, but the number of available pins for connections is reduced, limiting wiring freedom
Solution Approach 1:
The antenna structure is segmented into two distinct parts: solder balls forming the antenna element and separate package terminals for connections. This segmentation allows the antenna function to be fulfilled by solder balls while package terminals remain available for wiring, resolving the contradiction between volume reduction and wiring freedom.
Solution Approach 2:
Solder balls serve dual functions as both connection elements and antenna elements, while package terminals provide universal connection capability. This multi-functionality approach allows the system to achieve compact size through solder ball antenna formation while maintaining wiring flexibility through dedicated package terminals.
2Adaptability or versatility
If the number of package terminals is increased to maintain wiring freedom, then the degree of freedom in wiring is improved, but the size of the package increases
Solution Approach 1:
The package structure is segmented to distinguish between antenna-forming solder balls and connection-providing package terminals. This allows optimization of terminal count for wiring needs without necessarily increasing overall package size, as the antenna function is already fulfilled by the solder balls themselves.
Solution Approach 2:
The invention changes the functional parameter of solder balls from purely connective to antenna-forming, which alters the requirements for package terminals. This parameter change allows maintaining wiring freedom with a optimized terminal count that does not necessarily increase package size.
3Area of stationary object
If package terminals are positioned close to the antenna's main radiating part, then the package size is reduced, but induced currents in the terminals degrade antenna characteristics
Solution Approach 1:
The harmful effect of induced currents is extracted and minimized by strategically positioning package terminals outside the main radiating part region. This spatial extraction allows compact package design while preventing current induction that would degrade antenna performance.
Solution Approach 2:
Different regions of the package are assigned different qualities: the main radiating part region is optimized for antenna performance with no terminals, while other regions accommodate package terminals for connections. This local quality differentiation resolves the contradiction between compact size and antenna characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains antenna performance while increasing the degree of freedom in wiring by minimizing current-induced effects on package terminals and allowing for a more compact design without additional manufacturing steps or size increases.
Implementation Method 1
The antenna comprises a radiating element comprising a main radiating part... the main radiating part is arranged outside a first region and a second region
Data Source
AI summary
According to one embodiment, a wireless apparatus includes an antenna, a semiconductor chip and a board. The antenna comprises a radiating element includes a main radiating part. The semiconductor chip is connected with the antenna. The board has a first surface and a second surface, terminals are arranged on the first surface, and the semiconductor chip is arranged on the second surface. The main radiating part is arranged outside a first region and a second region, the first region is defined by imaginary lines passing through centers of peripheral terminals of the terminals, the second region is defined as a region where the first region is orthogonally projected onto the second surface.