Wireless BMS PCB Antenna Layout to Reduce ESS Signal Interference

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Solution Overview

Problem

Signal interference occurs due to complex wirings in energy storage systems (ESS) leading to inefficient communication between battery management systems (BMS), necessitating wireless communication solutions.

Innovation Solution

Implementing antenna pattern modules with inverted-F antenna (IFA) structures on flexible printed circuit boards (FPCBs) for short-range wireless communication between system BMS, rack BMS, and module BMS, reducing signal interference and enabling efficient wireless communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If complex wirings are installed for communication between BMS components, then communication coverage is ensured, but signal interference occurs and communication reliability deteriorates

Engineering Contradiction:
Improvecommunication reliabilityVSAvoidsignal interference
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical wiring system with a wireless communication system. Specifically, it uses Wi-Fi modules integrated into PCB boards to enable wireless communication between module BMS, rack BMS, and system BMS, thereby eliminating signal interference caused by complex physical wirings while maintaining communication reliability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces wireless communication modules as intermediaries between BMS components. These modules act as mediators that transmit communication signals without physical contact, avoiding the signal interference problems associated with direct wired connections through complex wiring systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If traditional wired communication is used between BMS components, then connection stability is maintained, but device complexity and installation cost increase

Engineering Contradiction:
Improvewiring complexityVSAvoidcommunication stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent substitutes mechanical wiring with wireless communication technology. Wi-Fi modules are integrated into the PCB boards of module BMS and rack BMS, enabling stable wireless communication without the need for complex physical wiring, thus reducing device complexity while maintaining connection stability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent makes the PCB boards multi-functional by integrating both control functions and wireless communication functions into the same board. This eliminates the need for separate wiring systems and reduces overall device complexity while maintaining reliable communication through the wireless capabilities of the integrated modules.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If wireless communication modules are integrated into PCB boards, then wiring complexity is reduced, but antenna space and manufacturing precision requirements increase

Engineering Contradiction:
Improveinstallation easeVSAvoidantenna pattern precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent merges the antenna structure with the PCB board itself. The antenna pattern is directly formed on the PCB substrate, combining the structural support function of the PCB with the electromagnetic radiation function of the antenna. This integration simplifies manufacturing by eliminating separate antenna components while maintaining precise antenna patterns through controlled PCB fabrication processes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the electrical and electromagnetic parameters of the PCB material and structure to create functional antenna patterns. By carefully controlling PCB parameters such as substrate thickness, copper trace geometry, and dielectric properties, precise antenna radiation patterns are achieved through standard PCB manufacturing processes, balancing manufacturing ease with precision requirements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces communication errors and costs by overcoming signal interference, providing spatial and cost advantages through FPCB-based IFA antennas, enabling efficient wireless communication between BMS components.

Implementation Method 1

an antenna pattern module is mounted on a surface of the second PCB... the antenna pattern modules being configured to enable wireless communication between the system BMS, the rack BMS, and the module BMS

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS20250279572A1BMS communication system and ESS communication system that wirelessly communicate with each other
Publication Date: 2025.09.04 SAMSUNG SDI CO LTD
  • US20250279572A1 patent drawing
  • US20250279572A1 patent drawing
  • US20250279572A1 patent drawing

AI summary

A battery management system (BMS) communication system includes a battery module including a housing and a plurality of battery cells in which a battery cell comprises a voltage sensing tab, a first printed circuit board (PCB) mounted on a side of the housing of the battery module and including a temperature sensor electrically connected to the voltage sensing tab of the battery cell to measure a temperature of the battery cell, and a second PCB stacked on a surface of the first PCB and including a cell sensing module electrically connected to the voltage sensing tab and the temperature sensor to exchange signals therewith, in which an antenna pattern module is mounted on a surface of the second PCB.