Wireless Bus Interconnect for 3D Chip-Carrier Packages

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Solution Overview

Problem

The high costs and design complexities associated with customizing 3D chip-carrier packages using through-silicon vias (TSVs) for vertical integration of semiconductor dies, which limit flexibility and increase manufacturing costs.

Innovation Solution

Implementing a wireless communication system using inductively coupled interconnects between semiconductor dies, allowing for a system bus that spans multiple dies and enabling communication through near-field inductive or capacitive coupling, thereby eliminating the need for physical TSVs and allowing for customization without hardware modifications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If through-silicon vias (TSVs) are used for vertical integration of semiconductor dies, then device density and system integration are improved, but design complexity, manufacturing cost, and customization flexibility deteriorate

Engineering Contradiction:

Improvecustomization flexibilityVSAvoiddesign complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical/physical TSV interconnect system with a wireless communication system. Instead of using physical through-silicon vias to connect stacked semiconductor dies, the invention uses wireless transceivers that communicate via electromagnetic fields, eliminating the need for physical contact and complex TSV fabrication processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces wireless electromagnetic fields as an intermediary medium for data transmission between semiconductor dies. Rather than direct physical connection through TSVs, information is transmitted through wireless signals that pass through the intermediate space between dies, enabling communication without physical contact.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If through-silicon vias (TSVs) are used for vertical integration of semiconductor dies, then device density and system integration are improved, but manufacturing and testing costs deteriorate

Engineering Contradiction:

Improvedevice densityVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If through-silicon vias (TSVs) are used for vertical integration of semiconductor dies, then vertical connection capability is improved, but customization cost and complexity deteriorate

Engineering Contradiction:

Improvevertical connection capabilityVSAvoidcustomization cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent introduces dynamic reconfigurability to the system, allowing wireless communication parameters such as frequency, data rate, and protocol to be changed on-the-fly. This dynamic capability enables the same physical hardware to adapt to different customization requirements without physical reconfiguration or additional manufacturing steps.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces design, manufacture, and testing costs while enabling flexible customization and strong power management of slave devices, allowing for interchangeable wireless slave devices and proprietary bus slaves, while maintaining system integration and security.

Implementation Method 1

enabling communication through near-field inductive or capacitive coupling

Methodology Applied

Scientific EffectNear-field inductive coupling: Electromagnetic Induction

Implementation Method 2

enabling communication through near-field inductive or capacitive coupling

Methodology Applied

Scientific EffectCapacitive coupling: Capacitance

Data Source

PatentUS11366779B2System-in-package architecture with wireless bus interconnect

Publication Date: 2022.06.21 ECS PARTNERS LTD

AI summary

A chip-carrier package includes a data processing system having one or more slave dies, a master die and a system bus. Each slave die includes a slave device and a slave-side wireless bus interface (WBI) coupled to the slave device. The master die includes a master device, one or more bus-side WBIs coupled to the master device. Each bus-side WBI is configured to be wirelessly coupled to at least one slave-side WBI of the one or more slave dies and a system bus. The system bus includes the one or more bus-side WBIs and the slave-side WBIs of the one or more slave-side dies. The system bus is configured to exchange information between the master device and the slave devices of the one or more slave dies.