Wireless Charger Coil Structure With Embedded Heat Dissipation Ring
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Solution Overview
Problem
Existing wireless chargers suffer from structural instability, poor heat dissipation, and slow charging speeds, which hinder their promotion and usage.
Innovation Solution
A wireless charger design incorporating an upper housing assembly, a lower housing assembly, a magnetic sheet coil, and a heat dissipation ring, with a concave structure on the lower housing assembly to form a cavity structure, where the heat dissipation ring is embedded in the magnetic sheet coil and thermally conductive adhesives are used to enhance heat transfer between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a wireless charger uses a simple structure without embedded heat dissipation components, then the device complexity is reduced, but the heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation ring is embedded within the magnetic sheet coil, forming a nested structure where the heat dissipation component is integrated inside the charging component. This nesting approach improves heat dissipation capability while minimizing the increase in device complexity, as the heat dissipation ring shares the same spatial envelope as the magnetic sheet coil.
Solution Approach 2:
The patent combines the heat dissipation function with the magnetic sheet coil structure by embedding the heat dissipation ring within it. This merging of functions allows the wireless charger to simultaneously perform wireless charging and heat dissipation without requiring entirely separate structural systems, thus improving heat dissipation while controlling overall complexity.
2Temperature
If thermally conductive adhesive is used to fill gaps between components, then heat dissipation capability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The thermally conductive adhesive serves as an intermediary substance that fills the gaps between the heat dissipation ring, magnetic sheet coil, and housing assemblies. This mediator approach improves heat dissipation capability by ensuring thermal contact across interfaces, while the adhesive's forgiving nature tolerates certain manufacturing tolerances, thus not excessively increasing precision requirements.
3Area of stationary object
If the heat dissipation ring is embedded in the magnetic sheet coil, then heat dissipation area is increased, but device complexity increases
Solution Approach 1:
By nesting the heat dissipation ring within the magnetic sheet coil, the patent maximizes the heat dissipation area within the available spatial envelope. The heat dissipation ring's outer surface area becomes available for thermal transfer while occupying the same radial space as the magnetic sheet coil, thus increasing heat dissipation area without proportionally increasing overall device volume or structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation capabilities and charging efficiency by effectively transferring heat from the upper housing assembly to the lower housing assembly, enhancing the overall heat dissipation area and speed of wireless charging.
Implementation Method 1
the heat dissipation ring may transfer heat in the upper housing assembly to the bottom of the lower housing assembly
Implementation Method 2
a gap among the upper housing assembly, the concave structure, the magnetic sheet coil, and the heat dissipation ring is filled with a thermally conductive adhesive
Data Source
AI summary
A wireless charger includes an upper housing assembly, a lower housing assembly, a magnetic sheet coil, and a heat dissipation ring. A concave structure is provided on an upper surface of the lower housing assembly, and the concave structure is coupled to the upper housing assembly to form a cavity structure. The cavity structure accommodates the magnetic sheet coil and the heat dissipation ring. The heat dissipation ring is embedded in the magnetic sheet coil and is in contact with the magnetic sheet coil. An upper surface of the heat dissipation ring is coupled to the upper housing assembly. A lower surface of the heat dissipation ring is coupled to a bottom of the concave structure of the lower housing assembly. The heat dissipation ring may transfer heat in the upper housing assembly to the bottom of the lower housing assembly.