Wireless Charger Thermal Management via Semiconductor Cooling
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Solution Overview
Problem
Current wireless chargers face inefficiencies due to high heat generation, which reduces charging speed and can damage equipment, as they attempt to manage heat by limiting power when temperatures rise, thereby compromising user experience.
Innovation Solution
A wireless charger design incorporating a cold conduction plate, semiconductor cooling sheet, and heat dissipation module, including a heat dissipation fan and fin, to actively cool both the electronic equipment and the charger, maintaining temperature balance and preventing overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-power wireless charging is used to improve charging speed, then charging efficiency is improved, but heat generation increases causing temperature to rise
Solution Approach 1:
The system is segmented into two independent modules: a wireless charging module for high-power charging and a semiconductor cooling module for active cooling. This segmentation allows each module to operate independently, enabling high-power charging without being constrained by heat management limitations.
Solution Approach 2:
A semiconductor cooling sheet acts as an intermediary between the wireless charging module and the electronic device. It absorbs heat generated during high-power charging before it transfers to the device, serving as a thermal buffer that enables high-speed charging while maintaining safe operating temperatures.
2Power
If high-load work is performed to improve charging power, then charging efficiency is improved, but heat transfer to electronic device increases
Solution Approach 1:
The heat generated during high-load wireless charging operation is converted from a harmful factor into a manageable parameter. The semiconductor cooling module captures and redirects this heat away from the electronic device, transforming the previously problematic heat transfer into a controlled thermal management process that enables sustained high-power charging.
3Reliability
If temperature is limited to protect internal components, then device safety is improved, but charging power is greatly reduced
Solution Approach 1:
Cooling action is performed preliminarily and continuously during the charging process rather than reactively after overheating occurs. The semiconductor cooling module actively removes heat as it is generated, preventing temperature rise before it reaches critical levels, thereby maintaining both device safety and high charging power throughout the charging cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages heat during wireless charging, enhancing charging efficiency and preventing equipment damage by actively cooling both the equipment and the charger, thereby improving user experience and extending device lifespan.
Implementation Method 1
a cold conduction plate... the first cold conduction surface is applied to sticking to the electronic equipment
Implementation Method 2
a semiconductor cooling sheet... when the power interface is powered on, the semiconductor cooling sheet cools down the electronic equipment
Implementation Method 3
a heat dissipation fan and a heat dissipation fin... the heat dissipation fan facilitates the heat dissipation fin to dissipate the heat
Implementation Method 4
the heat dissipation fin has a through hole arranged to form an accommodation space
Implementation Method 5
a heat conduction plate... the first heat conduction surface sticks to the semiconductor cooling sheet, and the second heat conduction surface is covering the heat dissipation fin
Implementation Method 6
a heat isolation plate is arranged between the heat conduction plate and the wireless charging module, the heat isolation plate is applied to blocking the heat conduction plate from transferring heat to the wireless charging module
Data Source
AI summary
A wireless charger, charging assembly, matching assembly and bracket for electric equipment, including: cold conduction plate, power interface, wireless charging module, semiconductor cooling sheet and heat dissipation module; power interface couples with wireless charging module and semiconductor cooling sheet respectively; cold conduction plate includes first and second cold conduction surface, first cold conduction surface sticks to electronic equipment, second cold conduction surface covers semiconductor cooling sheet; when powered on, wireless charging module charges electronic equipment, semiconductor cooling sheet cools down electronic equipment, heat dissipation module dissipates heat from semiconductor cooling sheet. By arranging semiconductor cooling sheet on side of wireless charging module sticking to electronic equipment, cooling down electronic equipment; arranging heat dissipation module on another side, dissipating heat on another end, guarantee temperature balance of the semiconductor cooling sheet, having solved effectively problem of heat generation when wireless charging electronic equipment, and affecting charging efficiency.