Wireless Charger Cooling Path with Thermoelectric Chips and Sealed Cover
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Solution Overview
Problem
Existing wireless chargers face challenges in heat dissipation and protection against water, liquid, and dust ingress, especially as charging speeds increase, and there are restrictions on placing electronic devices over the coils.
Innovation Solution
A wireless charger design featuring a conductive path from the electronic device to a metallic case using thermoelectric cooler chips or high-k heat-conducting materials for heat dissipation, with a top cover that prevents water and dust ingress, and includes features like EMI filters and magnetic material encapsulation for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wireless charging speed is increased, then charging efficiency is improved, but heat generation increases causing heat dissipation problems
Solution Approach 1:
The patent converts the harmful heat generated during high-speed wireless charging into a manageable thermal conduction problem by introducing a metallic case with high thermal conductivity. The metallic case acts as a heat sink that absorbs and dissipates the heat generated by the coils and electronic devices, transforming the harmful thermal energy into a controllable heat dissipation pathway.
Solution Approach 2:
The patent introduces a thermoelectric cooler chip as an intermediary component between the heat-generating coils and the metallic case. This intermediary actively manages heat transfer by providing a controlled thermal pathway, enabling efficient heat dissipation while maintaining optimal operating temperatures for high-speed charging.
2Adaptability or versatility
If the top surface has holes for coil exposure, then wireless charging function is enabled, but water and dust can enter the device
Solution Approach 1:
The patent employs a top cover made of insulating and heat-conducting material that can be configured with or without openings. This flexible cover design allows the device to maintain wireless charging functionality when needed while providing protection against water and dust ingress when the cover is closed, enabling adaptability between different operational states.
Solution Approach 2:
The top cover serves multiple functions: it provides structural protection, enables wireless charging through coil exposure when needed, and prevents water and dust ingress when closed. The metallic case also serves dual purposes as both a structural component and a heat dissipation pathway, demonstrating multi-functionality that resolves the contradiction between openness and protection.
3Productivity
If electronic devices are placed directly over coils, then charging efficiency is maximized, but heat concentration on the device increases
Solution Approach 1:
The patent converts the heat concentration problem into a beneficial heat dissipation opportunity by designing the metallic case as a large-area heat sink. The case absorbs heat from the coils and electronically transfers it to the surrounding environment, transforming the harmful heat concentration into a controlled thermal management system that enables sustained high-efficiency charging.
Solution Approach 2:
The patent addresses heat concentration by extending the heat dissipation pathway from a point-source approach to a distributed three-dimensional structure. The metallic case provides vertical and lateral heat conduction pathways, distributing thermal energy across multiple dimensions rather than allowing it to concentrate on the device surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat generated by electronic devices during charging while preventing water and dust ingress, ensuring efficient and reliable charging operations.
Implementation Method 1
a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat
Implementation Method 2
a metallic case, wherein at least one conductive element is disposed therein... form a heat conductive path from the top cover to the metallic case
Data Source
AI summary
A wireless charger comprises atop cover; a metallic case; and a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.