Wireless Charger Thermal Path for Sealed Heat Dissipation
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Solution Overview
Problem
Existing wireless chargers face challenges in heat dissipation and protection against water, liquid, and dust ingress, particularly as charging speeds increase.
Innovation Solution
A wireless charger design featuring a conductive path from the electronic device to a metallic case using a thermoelectric cooler chip or high-k heat-conducting material for heat dissipation, with a top cover devoid of holes to prevent ingress of water and dust, and incorporating features like EMI filters and magnetic materials for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wireless charging speed is increased, then charging efficiency is improved, but heat generation increases causing heat dissipation issues
Solution Approach 1:
The patent utilizes the generated heat as a beneficial factor by implementing a heating function that can be activated when heating is needed. The system converts the unavoidable heat generation from fast charging into a useful resource for heating applications, thereby resolving the heat dissipation issue while maintaining high charging speed.
Solution Approach 2:
The wireless charging device is designed to perform multiple functions: wireless charging, heat dissipation, and heating. By integrating these functions into a single system, the device can switch between charging mode and heating mode based on user needs, effectively managing heat generation while providing additional utility.
2Temperature
If the top surface has holes for ventilation, then heat dissipation is improved, but water, liquid, or dust can enter into the inside of the wireless charger
Solution Approach 1:
The patent employs a flexible membrane or film structure that allows heat to pass through while blocking water, liquid, and dust. This thin film acts as a selective barrier that maintains the protective sealing of the device while enabling thermal dissipation, thereby resolving the contradiction between heat dissipation and contamination prevention.
3Temperature
If a conductive path is established for heat dissipation, then heat management is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation function with existing structural components of the wireless charger. By integrating the conductive path into the device's housing or internal structure rather than adding separate dedicated components, the system achieves effective heat management while minimizing increases in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat and prevents ingress of contaminants, ensuring efficient and reliable charging while maintaining device integrity.
Implementation Method 1
a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device
Implementation Method 2
a high-k heat-conducting material, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the high-k heat conducting material for dissipating heat generated by an electronic device
Implementation Method 3
Wireless charger comprising a top cover... a metallic case, wherein at least one conductive element is disposed therein... for wireless charging the electronic device
Data Source
AI summary
A wireless charger comprises a top cover; a metallic case; and a first high-k heat-conducting material, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first high-k heat-conducting material for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.


