Wireless Charging Coil Assembly With Dual-Sided Heat Dissipation
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Solution Overview
Problem
Conventional wireless charging modules suffer from poor heat dissipation due to the use of ordinary films with low thermal conductivity and large thermal resistance, leading to decreased efficiency and reduced service life of electronic devices.
Innovation Solution
A wireless charging module with a magnetic shield part and a first heat dissipating layer on the coil surface, along with optional second heat dissipating layers on the magnetic shield part, utilizing materials with high thermal conductivity and adjustable thickness to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ordinary film is used to attach the coil, then the structure is simple and easy to manufacture, but the thermal conductivity is low and thermal resistance is large, resulting in poor heat dissipation
Solution Approach 1:
The patent changes the material parameters of the film from ordinary film with low thermal conductivity to a heat dissipation film with high thermal conductivity and low thermal resistance. This parameter change enables effective heat dissipation while maintaining the film's function as an attachment layer, resolving the contradiction between ease of manufacture and heat dissipation performance.
Solution Approach 2:
The patent employs a composite structure by combining the heat dissipation film with the coil and magnetic shield part. The heat dissipation film serves dual functions: attaching the coil and dissipating heat. This composite approach integrates multiple functions into a single component, improving heat dissipation without significantly complicating the manufacturing process.
2Device complexity
If the coil is bonded with spacer and ordinary film, then the assembly is simple, but air remains trapped at the interface, creating large thermal resistance and reducing heat transfer efficiency
Solution Approach 1:
The patent changes the thermal properties of the interface material from ordinary film to heat dissipation film with superior thermal conductivity. This enables the interface to effectively transfer heat even with the presence of air gaps, improving heat transfer efficiency without requiring complex assembly processes to eliminate air completely.
Solution Approach 2:
The heat dissipation film acts as an intermediary between the coil and the external environment, providing a thermal pathway that bridges the gap created by air at the interface. This intermediary material compensates for the poor thermal contact, maintaining reliable heat transfer efficiency without increasing device complexity.
3Temperature
If heat dissipation film with controllable thickness is used, then effective heat dissipation is achieved, but the thickness and cost of the wireless charging module may increase
Solution Approach 1:
The patent optimizes the thickness parameter of the heat dissipation film to achieve effective heat dissipation with minimal increase in module thickness. By carefully selecting and controlling the film thickness, the patent balances heat dissipation performance with compactness, avoiding excessive module thickness while maintaining effective thermal management.
Solution Approach 2:
The heat dissipation film is applied locally at the coil interface where heat generation is most intense. This localized approach concentrates the heat dissipation function where it is most needed, achieving effective thermal management without requiring the entire module to be thickened, thus minimizing the impact on overall module dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation results in improved heat dissipation, reducing coil temperature by up to 7.5% to 14.7%, enhancing the efficiency and service life of the charging module.
Implementation Method 1
the first heat dissipating layer with excellent radiation heat dissipation capability is helpful for heat dissipating of the coil
Implementation Method 2
The first heat dissipating layer is disposed on the surface of the coil away from the magnetic shield part
Data Source
AI summary
The present disclosure disclosed a wireless charging module which includes a magnetic shield part, a coil bonded to the magnetic shield part by a first adhesive member forming on a first surface of the coil and a first heat dissipating layer. The first heat dissipating layer is directly formed on a second surface of the coil by physical vapor deposition. wherein heat is dissipated from the second surface of the coil by the first heat dissipating layer and from the first surface of the coil by the first adhesive member and the magnetic shield part. By completely cover the coil with the first heat dissipating layer and the first adhesive member in the present disclosure, the first heat dissipating layer and the first adhesive member possesses excellent heat radiation, effectively improving the heat dissipation of the coil. Therefore, an effective and highly stable heat dissipating performance can be provided.