Wireless Charging Heat Conduction Plate Design

The heat conduction plate integrates multiple functions: it serves as both a structural support component and a thermal management system. The plate combines copper regions (for heat conduction from charging coil) and aluminum regions (for heat dissipation to shell), merging thermal management functionality into the existing structural framework rather than adding separate heat sinks or cooling systems.

The heat conduction plate uses composite material construction with different metal regions (copper and aluminum) having different thermal properties. The copper region provides excellent heat conduction from the charging coil, while the aluminum region facilitates heat dissipation to the shell, creating a functionally optimized composite structure that addresses thermal management challenges.

The non-conductive layer acts as an intermediary between the heat conduction plate and the chip. This layer thermally couples the chip to the heat conduction plate for efficient heat transfer, while simultaneously providing electromagnetic isolation to prevent interference from the charging coil and circuit board traces from affecting the chip operation.

The heat conduction plate features localized functional regions: a copper region positioned to contact the charging coil for heat absorption, an aluminum region for heat dissipation, and a specifically positioned non-conductive layer where the chip contacts the plate. This local differentiation of material properties and functions optimizes both thermal management and electromagnetic shielding at specific locations.