Wireless Charging Sensor Thermal Conductor
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wireless charging devices face challenges in accurately measuring surface temperatures during wireless power transmission/reception due to the misalignment of temperature sensors with conductive patterns, leading to inefficient heat dissipation and usability limitations.
Innovation Solution
A temperature sensor mounting structure is designed within the electronic device that includes a first and second plate, a side member, and printed circuit boards with the sensor positioned to accurately measure the temperature of the wireless power conductive patterns without increasing the device's thickness, allowing for effective heat dissipation control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If temperature sensors are mounted inside the electronic device, then the device thickness can be maintained, but the temperature measurement accuracy of the surface temperature decreases
Solution Approach 1:
A thermal conductor element is introduced as an intermediary between the wireless charging coil and the temperature sensor. This element conducts heat from the coil to the sensor, enabling the internally-mounted sensor to accurately measure the surface temperature of the wireless charging component without requiring increased device thickness.
Solution Approach 2:
The patent replaces direct physical contact measurement (mechanical proximity) with thermal conduction-based measurement. Instead of placing the sensor directly against the coil surface, the system uses thermal conduction through the thermal conductor element to transfer temperature information to the sensor.
2Device complexity
If temperature sensors are positioned away from conductive patterns, then the device structure is simplified, but the temperature measurement accuracy decreases
Solution Approach 1:
The thermal conductor element serves as a mediator that bridges the gap between the conductive pattern and the temperature sensor. It maintains thermal coupling between the two components while allowing spatial separation, thus simplifying the overall device structure while preserving measurement accuracy.
3Productivity
If wireless power transmission efficiency decreases due to misalignment, then heat energy is generated, but the surface temperature increases causing usability limitations
Solution Approach 1:
The temperature sensor continuously monitors the temperature of the wireless charging coil and provides feedback to the control system. When misalignment causes temperature increase, the system can detect this through the sensor and adjust power transmission parameters or provide user guidance to improve alignment, thereby maintaining efficiency and preventing overheating.
Solution Approach 2:
The patent converts the harmful effect of heat generation into a useful measurement signal. By using the thermal conductor element to channel heat to the temperature sensor, the system transforms the waste heat from inefficient power transmission into actionable temperature data that enables corrective control actions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate temperature measurement and effective heat dissipation in wireless charging devices, enhancing their usability by preventing overheating and maintaining performance during power transmission/reception.
Implementation Method 1
Wireless charging may be mainly classified into a charging type using electromagnetic induction
Implementation Method 2
a temperature sensor disposed around the coil on the PCB
Data Source
AI summary
Various embodiments of the present disclosure may provide an electronic device that includes: a first plate directed in a first direction, a second plate directed in a second direction opposite to the first direction, and a side member configured to surround at least a part of the space between the first and second plates; a first printed circuit board (PCB) that is disposed between the first and second plates and includes at least one processor; a second printed circuit board (PCB) that is disposed between the first printed circuit board and the second plate and includes at least one antenna pattern; and a temperature sensor disposed to measure the temperature of at least a part of the second printed circuit board. Other various embodiments are possible.


