Wireless Charging Thermal Management via Partitioned Heat Dissipation
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Solution Overview
Problem
Conventional wireless charging devices generate excessive heat, primarily due to the transmitter coil and driving board, which can lead to reduced charging power and speed as they overheat the mobile device, with inadequate heat dissipation methods focusing only on the transmitter driving board and ignoring the receiver coil's sensitivity to heat.
Innovation Solution
The wireless charging device incorporates a casing with a partition plate and lateral walls made of high thermal conductivity materials, along with fins and an airflow-guiding cover, to manage heat dissipation by increasing interfacial thermal resistance and reducing thermal resistance of the transmitter coil assembly, ensuring that the heat generated by the transmitter coil and driving board is dissipated effectively away from the receiver coil.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the distance between the transmitter coil and the receiver coil is reduced to achieve better charging efficacy, then charging power is improved, but the receiver coil temperature increases excessively
Solution Approach 1:
The patent divides the heat dissipation system into separate zones: the transmitter driving board has its own heat dissipation structure, and the transmitter coil assembly has its own heat dissipation structure. This segmentation allows independent optimization of heat dissipation for each component, enabling the receiver coil to operate at optimal temperature while maintaining high charging power.
Solution Approach 2:
The patent introduces a heat dissipation structure as an intermediary between the transmitter coil assembly and the receiver coil. This intermediary structure conducts heat away from the transmitter coil assembly, preventing direct heat transfer to the receiver coil, thus allowing close proximity operation without excessive temperature rise in the receiver coil.
2Device complexity
If the mobile device is used as the main heat dissipation path, then heat dissipation is simplified, but the mobile device overheats and charging power is reduced
Solution Approach 1:
The patent extracts the heat dissipation function from the mobile device by introducing dedicated heat dissipation structures in the wireless charging device. The heat dissipation paths are separated from the mobile device, allowing the mobile device to focus on charging reception while the external heat dissipation structures handle thermal management, thus preventing mobile device overheating and maintaining charging power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances charging power and speed by maintaining the receiver coil's temperature within safe limits, preventing overheating and ensuring efficient heat dissipation, thus maintaining optimal performance.
Implementation Method 1
The transmitter driving board receives the external electric energy to drive the transmitter coil. The mobile device includes a receiver coil. Due to an electromagnetic coupling effect between the receiver coil and the transmitter coil, the receiver coil receives the electric energy from the transmitter coil.
Implementation Method 2
Due to an electromagnetic coupling effect between the receiver coil and the transmitter coil, the receiver coil receives the electric energy from the transmitter coil.
Implementation Method 3
The transmitter driving board has a first thermal resistance. The transmitter coil assembly has a second thermal resistance, and there is an interfacial thermal resistance between the transmitter coil assembly and the transmitter driving board.
Data Source
AI summary
A wireless charging device includes a casing, a transmitter driving board and a transmitter coil assembly. The wireless charging device is used for charging a receiver coil of a mobile device. The transmitter driving board generates a first heat source. The transmitter driving board has a first thermal resistance. The transmitter coil assembly generates a second heat source. The transmitter coil assembly has a second thermal resistance. There is an interfacial thermal resistance between the transmitter coil assembly and the transmitter driving board. A product of a power dissipation of the second heat source and the second thermal resistance is lower than 15. The interfacial thermal resistance is higher than or equal to two times the first thermal resistance. A product of a power dissipation of the first heat source and the first thermal resistance is lower than or equal to 80.