Wireless Chiplet Communication Using RF Links in Multi-Chip Packages
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Solution Overview
Problem
Current technologies face challenges in achieving high-performance, cost-efficient, and flexible chip-to-chip communication in multi-chip modules due to limitations in wired interconnects, such as scalability issues with silicon interposers and embedded multi-die interconnect bridges, which restrict data transport rates and increase costs.
Innovation Solution
Implementing wireless chip-to-chip (WC2C) communication using protocols divided into control and data planes, with antennas and RF circuitry enabling direct links between chiplets, reducing data traffic through TSVs and interposers, and utilizing miniaturized antenna technologies for sub-10 GHz frequencies to facilitate flexible and high-speed data transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If wired interconnects (silicon interposers and embedded multi-die interconnect bridges) are used for chip-to-chip communication, then structural support and electrical connection are provided, but data transport rates are restricted and costs increase
Solution Approach 1:
The patent replaces wired mechanical interconnects (silicon interposers and embedded multi-die interconnect bridges) with wireless electromagnetic communication. Each chiplet is equipped with antennas that enable direct wireless data transmission, eliminating the need for physical wired connections and thereby increasing data transport rates while reducing interconnect structure complexity
Solution Approach 2:
The patent extracts the communication function from the wired interconnect structure by introducing independent wireless communication capabilities (antennas and RF circuitry) on each chiplet. This allows data transport to occur independently of the mechanical support structure, resolving the contradiction between structural complexity and data transport rate
2Adaptability or versatility
If silicon interposers and embedded multi-die interconnect bridges are used, then chiplets are connected and supported, but scalability is limited and costs increase
Solution Approach 1:
The patent segments the communication function from the interconnect structure by equipping each chiplet with independent wireless communication capabilities. This segmentation allows each chiplet to communicate independently without requiring complex wired interconnect structures, thereby improving system scalability and reducing manufacturing costs
Solution Approach 2:
The patent implements universal wireless communication capabilities across all chiplets, allowing any chiplet to communicate with any other chiplet directly. This multi-functional approach eliminates the need for dedicated wired connections between specific chiplet pairs, enhancing system scalability and simplifying manufacturing
3Productivity
If direct wired connections are implemented between chiplets, then data transport is enabled, but thermal and mechanical constraints are imposed
Solution Approach 1:
The patent replaces wired mechanical and thermal conduction paths with wireless electromagnetic communication. By using antennas and RF circuitry for data transmission, the system eliminates the thermal constraints associated with dense wired interconnects while maintaining high data transfer speeds
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
WC2C communication enhances device performance, efficiency, and allows for massive 3D heterogeneous integration by providing high-speed data transport and flexible network topologies, reducing costs and thermal/mechanical constraints while enabling dynamic reconfigurable data-center networks.
Implementation Method 1
Each of the first device and the second device may include an antenna, a radio frequency front-end circuit, and a baseband circuit
Data Source
AI summary
In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.