Wireless Coil Base Assembly Using Segmented Magnetic Elements
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Solution Overview
Problem
Existing wireless transmission modules, including those for wireless charging and communication, face challenges in achieving optimal performance, efficiency, and miniaturization while minimizing thickness and electromagnetic interference.
Innovation Solution
A wireless transmission module design featuring a base assembly composed of magnetically conductive elements that form a solid plate-shaped structure upon heating and pressurization, securely fixing the coil without adhesives, enhancing mechanical strength, efficiency, and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetically conductive substrate is used to support the coil, then magnetic field concentration is improved, but device thickness and weight increase
Solution Approach 1:
The magnetically conductive substrate is divided into discrete magnetically conductive elements (particles, flakes, or granules) with diameters less than 0.05mm. These segmented elements are embedded in an adhesive layer, creating a distributed magnetic field concentration system that achieves the same functional effect with reduced material volume and weight.
Solution Approach 2:
The use of discrete magnetically conductive elements creates a porous or particulate structure within the adhesive layer. This porous arrangement allows the magnetic field to be concentrated through multiple scattered pathways rather than a solid continuous substrate, reducing the overall material density while maintaining magnetic field concentration effectiveness.
2Ease of manufacture
If adhesive materials are used to fix the coil, then ease of manufacture is improved, but high-temperature resistance and structural strength deteriorate
Solution Approach 1:
The adhesive material parameters are optimized by selecting materials with melting points between 70°C and 400°C, specifically targeting high-temperature resistance. The adhesive's mechanical properties are enhanced through parameter selection to achieve both ease of application and strong bonding strength that can withstand thermal and mechanical stresses during operation.
3Productivity
If the coil structure is optimized for better charging performance, then charging efficiency is improved, but electromagnetic interference increases
Solution Approach 1:
The magnetically conductive elements are strategically positioned and distributed within the adhesive layer to convert potentially harmful scattered magnetic fields into beneficial concentrated flux patterns. The discrete elements act as magnetic flux guides that channel electromagnetic energy efficiently while reducing unwanted radiation and interference.
4Volume of moving object
If the module is miniaturized, then device compactness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The magnetically conductive substrate is segmented into small particles with diameters less than 0.05mm, which can be easily dispersed and distributed throughout the adhesive layer. This segmentation allows the magnetic functionality to be integrated into a thin, flexible layer that can be applied to compact coil structures without requiring high-precision alignment or assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves mechanical strength, charging efficiency, heat dissipation, miniaturization, and reduces electromagnetic interference, achieving overall lightweight and efficient wireless transmission.
Implementation Method 1
the wireless charging receiving terminal inside the electronic device generates current via electromagnetic induction or electromagnetic resonance
Implementation Method 2
the wireless charging receiving terminal inside the electronic device generates current via electromagnetic induction or electromagnetic resonance
Implementation Method 3
The melting point of the first adhesive element is higher than 70 degrees Celsius. The melting point of the first adhesive element is lower than 400 degrees Celsius.
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
A wireless transmission module (100) corresponds to an electronic module (200) and is configured to transmit a first signal. The wireless transmission module includes a corresponding surface (102S1), a base assembly (102), and a first coil (104). The corresponding surface faces the electronic module and is perpendicular to a main axis (AX). The first coil (104) is disposed on the base assembly (102). The first coil (104) overlaps at least a portion of the base assembly (102) when viewed along the main axis (AX). The first coil (104) overlaps at least a portion of the base assembly (102) when viewed in a direction that is perpendicular to the main axis (AX).