Wireless Coupling Conductive Patterns for Semiconductor Chip Interconnects

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Solution Overview

Problem

Current semiconductor devices face limitations in achieving high operating speed and efficient communication between stacked semiconductor chips and transceivers due to the presence of conductive media, which can lead to connection defects and increased device height.

Innovation Solution

The implementation of through electrodes and coupling conductive patterns for wireless communication between semiconductor chips and transceivers, allowing for parallel wireless and wired transmission of power and signals, or direct wireless transmission of signals, thereby reducing communication distance and eliminating the need for conductive media.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive media are used for transmission between semiconductor chips and transceivers, then electrical connection is established, but device height increases and connection defects occur

Engineering Contradiction:

Improveconnection reliabilityVSAvoiddevice height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent replaces the mechanical contact system (conductive media requiring physical connection) with an electromagnetic field-based wireless communication system. The transceiver and semiconductor chip communicate through electromagnetic coupling between conductive patterns, eliminating the need for physical conductive media and thereby reducing device height while maintaining reliable signal transmission.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If conductive media are used for transmission, then power and signals can be transmitted, but connection defects increase

Engineering Contradiction:

Improvetransmission reliabilityVSAvoidconnection defects

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent eliminates mechanical contact between conductive media by using wireless electromagnetic coupling. The conductive pattern on the semiconductor chip and the conductive pattern on the transceiver communicate through electromagnetic fields, removing sources of connection defects such as contact resistance, oxidation, and mechanical failure while maintaining reliable power and signal transmission.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces electromagnetic fields as an intermediary medium for power and signal transmission. Instead of direct physical contact between conductive media, the electromagnetic field serves as the mediator that transfers energy and information between the transceiver and semiconductor chip, eliminating the need for physical connection and associated defects.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If wireless communication is implemented, then transmission efficiency improves and device size reduces, but separate paths for power and signals are required

Engineering Contradiction:

Improvetransmission efficiencyVSAvoidtransmission path complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the transmission functions by providing separate conductive patterns for power transmission and signal communication. The first conductive pattern on the transceiver and corresponding pattern on the semiconductor chip are dedicated to power transmission, while the second conductive patterns handle signal communication, allowing optimized performance for each function while maintaining overall system efficiency.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances transmission efficiency, reduces device size, and minimizes connection defects by eliminating the need for conductive media, leading to improved performance and reliability in high-speed semiconductor devices.

Implementation Method 1

a first coupling conductive pattern 130 electrically connected to the through electrode 126... a second coupling conductive pattern 150 which communicates wirelessly with the first coupling conductive pattern 130

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS9165893B2Semiconductor device including coupling conductive pattern

Publication Date: 2015.10.20 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor device is disclosed including a through electrode. The semiconductor device may include a first semiconductor chip including a transceiver circuit formed on a first surface, a first coupling conductive pattern which is formed on a second surface opposite the first surface, and a through electrode which connects the transceiver circuit and the first coupling conductive pattern. There may be a transceiver located on a second semiconductor chip and including a second coupling conductive pattern facing the first coupling conductive pattern which communicates wirelessly with the first coupling conductive pattern.