Wireless Device Antenna and Thermal Housing Design
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Solution Overview
Problem
Removable wireless devices face challenges in achieving a compact size with high antenna efficiency and low cost, while also requiring improved thermal dissipation due to reduced size and increased heat generation from dense component arrangements.
Innovation Solution
The design incorporates a substrate with a printed antenna element and a 3-dimensional antenna element, jointly achieving the desired frequency band length, and a housing made of metal that is thermally coupled to chips for heat dissipation through both conduction and convection, utilizing a wide power trace layout and complete conductive layers within the substrate for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the wireless device is reduced to make it more compact, then the device becomes more portable and less intrusive, but the area available for heat dissipation is reduced and thermal management becomes more difficult
Solution Approach 1:
The patent utilizes the housing as a three-dimensional heat dissipation structure that extends beyond the substrate plane. The housing provides vertical and lateral heat dissipation paths, transforming the two-dimensional heat dissipation problem into a three-dimensional solution, allowing effective thermal management in a compact device volume.
Solution Approach 2:
The housing serves multiple functions: it provides mechanical protection for the substrate and chips, acts as a thermal conduction path from the chips to the environment, and functions as a heat dissipation surface. This multi-functionality allows the same structure to address both device compactness and thermal management requirements.
2Volume of moving object
If chips and components are arranged densely to reduce device size, then the device becomes more compact, but the heat generation inside the device increases
Solution Approach 1:
The patent extracts the heat dissipation function from the substrate layer and assigns it to the housing structure. By separating the computational function (chips on substrate) from the thermal management function (housing), the design can maintain dense component arrangement while providing dedicated thermal management capability through the housing's conduction and convection pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact wireless device with enhanced antenna efficiency and improved thermal dissipation, reducing operating temperatures and maintaining a compact form factor.
Implementation Method 1
The housing is thermally coupled to the first chip, and is utilized for dissipating heat of the first chip
Implementation Method 2
the opening facilitates to dissipate heat of the first chip and heat of the second chip to the outside of the wireless device by heat convection
Data Source
AI summary
The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed antenna element is printed on the substrate, while the 3-dimensional antenna element is disposed on the substrate and coupled to the printed antenna element. The printed antenna element and the 3-dimensional antenna element jointly have a physical length of a desired frequency.