Wireless Device Heat Fins on Reflector Plate
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Solution Overview
Problem
Existing wireless communication devices face limited heat dissipation performance when mounted on walls or pillars, as heat dissipation fins are often covered, leading to reduced airflow and inefficient heat dissipation.
Innovation Solution
A wireless communication device design featuring a reflector plate with heat dissipation fins standing on its surface, equipped with a frequency selective surface, which allows for efficient heat dissipation without obstructing electromagnetic waves and maintains a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation fins are provided on the back surface side of the reflector plate, then heat dissipation performance is improved, but when mounted on a wall surface or pillar, the majority of the heat dissipation fins are covered and heat dissipation performance becomes limited
Solution Approach 1:
The heat dissipation fins are changed from a planar arrangement on the back surface to a three-dimensional arrangement standing on the reflective surface. This dimensional change allows the fins to extend outward in space, ensuring that even when the device is mounted on a wall or pillar, the fins remain exposed to airflow from multiple directions, thereby maintaining effective heat dissipation performance while preserving mounting flexibility.
2Temperature
If a metal reflector plate occupying a relatively large area is utilized as a heat dissipation path, then heat dissipation performance per volume is improved, but the device size increases
Solution Approach 1:
Instead of expanding the reflector plate area in two dimensions to improve heat dissipation, the invention utilizes the third dimension by standing heat dissipation fins on the reflective surface. This vertical arrangement increases the heat dissipation surface area without significantly increasing the device's footprint or volume, thereby improving heat dissipation performance per volume while maintaining a compact device size.
Solution Approach 2:
The invention concentrates heat dissipation functionality at specific locations where fins are stood on the reflective surface, rather than requiring a uniformly large reflector plate. This localized approach to heat dissipation allows effective thermal management with a smaller overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves improved heat dissipation performance by increasing the area of heat contact with air while preventing heat dissipation fins from hindering wireless communication, thus maintaining a compact size.
Implementation Method 1
a reflector plate 101 having a reflective surface 101a that reflects electromagnetic waves
Implementation Method 2
heat dissipation fins 108 that stand on the reflective surface 101a
Implementation Method 3
improve heat dissipation performance by increasing the area of heat contact with air
Data Source
AI summary
A wireless communication device includes: a reflector plate that comprises a reflective surface, the reflective surface reflecting an electromagnetic wave; an array antenna that comprises a plurality of antenna elements, the antenna elements being arranged on the reflective surface; one or more fins that stand on the reflective surface; and a transmission and reception circuit that is connected to the reflector plate, and transmits and receives a wireless signal via the array antenna.


