Wireless Communication Device Package Layout for Crosstalk Reduction
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Solution Overview
Problem
Existing wireless communication devices face challenges in miniaturization and component reduction due to coupling issues between amplifiers and crystal vibration pieces, leading to crosstalk and instability in oscillation frequencies.
Innovation Solution
Integration of a vibration piece and a semiconductor device into a single package, with the excitation electrode positioned to avoid overlap with the amplifier, and separate arrangement of noise-prone components to minimize crosstalk, using a fractional N-type PLL circuit for precise frequency generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the vibration piece and semiconductor device are integrated into one package for miniaturization, then the device size is reduced, but coupling occurs between the amplifier and vibration piece causing crosstalk and oscillation frequency instability
Solution Approach 1:
The patent applies three-dimensional packaging technology where the vibration piece is positioned at a different vertical level (Z-axis) relative to the semiconductor device. The excitation electrode of the vibration piece is arranged not to be superimposed on the amplifier when viewed from above, effectively utilizing the third dimension to separate components that would otherwise occupy the same planar space, thereby reducing coupling while maintaining compact footprint.
2Area of moving object
If the excitation electrode is positioned close to the amplifier for compact layout, then the device area is reduced, but reference leak and digital noise occur affecting oscillation precision
Solution Approach 1:
The patent positions the excitation electrode in the vertical dimension rather than purely in the planar dimension. By arranging the excitation electrode not to be superimposed on the amplifier when viewed from above, the design utilizes the Z-axis separation to maintain adequate spacing between the excitation electrode and amplifier, reducing electromagnetic coupling and reference leak while keeping the overall device footprint compact.
3Device complexity
If discrete IC and crystal vibrator are combined into one package, then the number of components is reduced, but coupling causes mutual bad influence between amplifier and oscillation circuit
Solution Approach 1:
The patent utilizes three-dimensional packaging to spatially separate the amplifier and oscillation circuit in the vertical dimension. The excitation electrode is arranged at a different vertical level and positioned not to be superimposed on the amplifier when viewed from above, effectively reducing electromagnetic coupling and harmful interactions between components while maintaining them as an integrated single-package device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high-precision oscillation frequencies, reduces crosstalk, and enables miniaturization of wireless communication devices while maintaining low power consumption and high receiving sensitivity.
Implementation Method 1
a vibration piece 30 and a semiconductor device 20 that is connected to the vibration piece 30, wherein the semiconductor device 20 includes an oscillation circuit 100 of the vibration piece 30
Implementation Method 2
a wireless communication circuit 200 that has an amplifier 220 which amplifies a wireless signal which is generated based on an oscillation signal from the oscillation circuit 100
Data Source
AI summary
A wireless communication circuit includes a vibration piece, and a semiconductor device that is connected to the vibration piece in order to integrate the vibration piece and a wireless communication IC into one package and thus to produce a wireless communication device by which a high-precision oscillation frequency is obtained. The semiconductor device includes an oscillation circuit of the vibration piece, and a wireless communication circuit that has an amplifier which amplifies a wireless signal that is generated by an oscillation signal from the oscillation circuit. The vibration piece and the semiconductor device are accommodated in one package. An excitation electrode of the vibration piece is arranged in the package in such a manner that the excitation electrode is not superimposed on the amplifier when the semiconductor device is viewed from above.