Wireless Device Shielding with Conductive Wall and Layer

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Solution Overview

Problem

Conventional high-frequency modules have a reduced shielding effect due to an open shielded side around the antenna, and their structure is limited to lead-frame based modules, failing to effectively integrate ground connection for enhanced electromagnetic shielding.

Innovation Solution

A wireless device design incorporating a semiconductor chip, radiation element, sealing resin, conductive layer, and a conductive wall connected to the conductive layer, which covers the sealing resin and provides enhanced shielding by blocking unintentional electromagnetic fields while allowing efficient radiation and reception of electromagnetic waves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the shielded side around the antenna is left open to maintain simplicity, then the device complexity is reduced, but the shielding effect is reduced

Engineering Contradiction:

Improvestructure complexityVSAvoidshielding effect

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The shielding structure is segmented into multiple parts: a box-shaped shield case covering the semiconductor chip, a conductive layer covering the sealing resin surface, and a conductive wall extending from the shield case to cover the antenna region. This segmentation allows each component to contribute to the overall shielding effect without requiring a completely enclosed complex structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shielding approach transitions from two-dimensional planar shielding to three-dimensional multi-layer shielding by adding vertical conductive walls and layered conductive structures. The conductive wall extends upward from the shield case bottom surface, creating vertical shielding barriers that block electromagnetic fields without requiring full enclosure on all sides.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a lead-frame structure is used to simplify manufacturing, then the ease of manufacture is improved, but the adaptability to different module types is reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidmodule type applicability

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The shielding structure is designed with universal applicability to multiple module types including lead-frame modules, BGA modules, and QFN modules. The shield case and conductive wall configuration can be adapted to different package types without fundamental design changes, allowing the same shielding approach to protect various semiconductor module configurations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The shielding structure parameters such as shield case dimensions, conductive wall height, and conductive layer configuration can be adjusted to suit different module types and frequency ranges. This parameter flexibility allows the same basic shielding design to be applied across various module configurations while maintaining effective shielding performance.

Inventive Principle:

Principle #35Parameter changes

3Object-affected harmful factors

If the shield case is extended to fully enclose the antenna, then the shielding effect is improved, but the radiation efficiency of the antenna is reduced

Engineering Contradiction:

Improveshielding effectVSAvoidradiation efficiency

Core Design Contradiction:

Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The shielding structure applies different shielding characteristics to different regions: the box-shaped shield case provides enclosure for the semiconductor chip region, while the conductive wall provides selective shielding for the antenna region. This localized shielding approach ensures adequate protection for sensitive components while maintaining radiation efficiency in the antenna region by avoiding complete enclosure.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly enhances the shielding effect by suppressing unintentional electromagnetic fields while maintaining the functionality of the radiation element, improving the overall performance of the wireless device.

Implementation Method 1

a conductive wall 107 connected to the conductive layer 106 is provided between the semiconductor chip 102 and the radiation element 103... the conductive layer 106 and the conductive wall 107 suppress an unintentional electromagnetic field

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

the radiation element 103 efficiently radiates or receives electromagnetic waves

Methodology Applied

Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS8874048B2Wireless device, and information processing apparatus and storage device including the wireless device

Publication Date: 2014.10.28 KK TOSHIBA

AI summary

According to one embodiment, a wireless device includes a board, a semiconductor chip, a radiation element, a sealing resin, a conductive layer, and a first conductive wall. The semiconductor chip is mounted on the board and includes a transmission/reception circuit. The radiation element is formed on the board. The sealing resin seals the semiconductor chip. The conductive layer covers at least a portion of a surface of the sealing resin. The first conductive wall is provided between the semiconductor chip and the radiation element and is connected to the conductive layer.