Wireless Interconnects on Flexible Cables for High-Speed Data Transfer
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Solution Overview
Problem
High-performance computing systems face limitations in data communication speed due to the numerous interfaces and physical obstructions in traditional copper interconnects and optical fiber systems, which hinder efficient chip-to-chip communication and increase complexity and cost.
Innovation Solution
The implementation of a wireless interconnect using millimeter-wave circuitry and flexible dielectric cables with integrated antennas, allowing for high-bandwidth data transmission through free space or dielectric waveguides, which reduces bulk and alignment requirements and is adaptable to various systems, including server platforms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional copper interconnects are used for chip communication, then established infrastructure and compatibility are maintained, but data communication speed is limited due to numerous interfaces and physical obstructions
Solution Approach 1:
The patent extracts the communication function from the traditional copper interconnect infrastructure by introducing wireless communication capabilities directly into the chip package. This removes the signal from the constrained copper trace environment and places it in a wireless electromagnetic field environment, thereby eliminating the speed limitations imposed by the physical copper interconnect structure while maintaining the necessary communication function.
Solution Approach 2:
The patent replaces the mechanical/electrical copper interconnect system with an electromagnetic wireless communication system. By substituting physical copper traces and connectors with wireless electromagnetic signal transmission, the system eliminates the speed bottlenecks and interface complexity inherent in the mechanical copper interconnect architecture.
2Speed
If flexible connector cables are used to bypass socket and motherboard, then data path is shortened, but physical obstructions and alignment requirements still exist
Solution Approach 1:
The patent replaces the mechanical flexible cable system with a wireless communication system. This substitution eliminates the need for physical alignment and connection of flexible cables, as wireless electromagnetic signals can transmit data without requiring precise mechanical alignment or physical contact between components.
Solution Approach 2:
The patent introduces wireless electromagnetic waves as an intermediary medium for data transmission between chips. This intermediary allows data to pass through the space between chips without requiring direct physical connection or alignment, thereby eliminating the alignment requirements and physical obstructions associated with flexible cable systems.
3Speed
If optical fibers are used for long distance communication, then data rate is improved, but bulk and alignment requirements increase system complexity
Solution Approach 1:
The patent replaces the optical fiber mechanical system with a wireless communication system. This eliminates the need for bulk optical fiber cables and their associated alignment requirements, as wireless electromagnetic signals can transmit at high data rates without requiring physical cable infrastructure or precise alignment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables scalable, high-speed data transfer with reduced complexity and cost, overcoming obstructions and achieving multi-Gbps data rates while being flexible and adaptable for different configurations.
Implementation Method 1
a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data
Implementation Method 2
a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide
Data Source
AI summary
Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.