Wireless Headset Rigid-Flexible Circuit Board Integration
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Solution Overview
Problem
Conventional wireless headsets have a low component integration degree due to the limited space, requiring multiple circuit boards and flexible connections that can lead to signal distortion and product failures.
Innovation Solution
A wireless headset design utilizing a rigid-flexible circuit board with a stack assembly of substrates and chips, eliminating the need for secondary circuit boards and reducing signal transmission path length, thereby enhancing component integration and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple secondary circuit boards are used to accommodate chips, then component integration can be achieved, but device complexity increases and space utilization decreases
Solution Approach 1:
The patent merges multiple secondary circuit boards into a single rigid circuit board. The main control module integrates audio processing chips, wireless communication chips, and other components directly onto this one board, eliminating the need for multiple separate secondary boards and their associated flexible circuit board connections.
Solution Approach 2:
The single rigid circuit board serves multiple functions simultaneously: it acts as the main control module substrate, hosts various functional chips (audio processing, wireless communication, sensor integration), and provides structural support. This multi-functional design replaces the conventional multi-board architecture.
2Reliability
If flexible circuit boards are used to connect components, then component connectivity is achieved, but signal transmission quality deteriorates due to longer transmission paths
Solution Approach 1:
The patent removes flexible circuit boards from the system architecture. By integrating all components directly onto the rigid circuit board, the need for flexible inter-connectors is eliminated, thereby removing the source of signal transmission issues associated with flexible board connections.
3Quantity of substance
If a rigid circuit board with large board area is used, then component integration is improved, but it cannot be arranged in the limited space of the wireless headset
Solution Approach 1:
The patent transitions from a distributed multi-board three-dimensional arrangement to a consolidated single-board planar layout. By flattening the architecture into one rigid circuit board, the design optimizes space utilization within the headset's limited volume while maintaining high component integration density.
Data Source
AI summary
The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.