Wireless IC Blocks with Ground Ring Shielding

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Solution Overview

Problem

Conventional methods for coupling integrated circuit (IC) devices to substrates are costly and prone to manufacturing defects, and communications between IC devices are susceptible to electromagnetic interference, which compromises system performance.

Innovation Solution

The implementation of wirelessly enabled functional blocks with ground rings that provide electromagnetic shielding, allowing for ohmic and wireless coupling of IC devices to substrates and printed circuit boards, reducing interference and enhancing communication fidelity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wirebonds or solder bumps are used to couple IC die to substrate, then electrical connection is achieved, but manufacturing defects increase and throughput decreases

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmanufacturing throughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces mechanical wirebonds and solder bumps with a direct flip-chip mounting approach where the IC die is flipped and mounted directly onto the substrate with contact elements, eliminating the need for wirebonds or solder bumps and thereby reducing manufacturing defects and improving throughput

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of operation

If IC devices are coupled using PCB with conventional connection elements, then communication between devices is enabled, but connection elements break or damage during manufacturing or field application

Engineering Contradiction:

Improvedevice coupling capabilityVSAvoidconnection durability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent replaces conventional PCB connection elements with wireless communication blocks that enable communication between IC devices without physical connection elements, eliminating the problem of connection element breakage during manufacturing or field application

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If conventional PCB coupling is used, then IC devices can communicate, but electromagnetic interference compromises communication fidelity

Engineering Contradiction:

Improvecommunication capabilityVSAvoidcommunication fidelity

Core Design Contradiction:

Ease of operationVSLoss of information

Solution Approach 1:

The patent replaces conventional electrical communication through PCB traces with wireless communication blocks that transmit signals wirelessly between IC devices, eliminating electromagnetic interference from PCB traces and improving communication fidelity

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces wireless communication blocks as intermediary elements between IC devices, enabling communication without direct electrical connection through PCB traces, thereby eliminating electromagnetic interference while maintaining communication capability

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the likelihood of manufacturing defects and electromagnetic interference, improving the reliability and performance of IC device communications by using ground rings as Faraday cages and common grounds for the components.

Implementation Method 1

ground rings that provide electromagnetic shielding, allowing for ohmic and wireless coupling of IC devices to substrates and printed circuit boards, reducing interference and enhancing communication fidelity

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS8928139B2Device having wirelessly enabled functional blocks

Publication Date: 2015.01.06 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD

AI summary

Embodiments described herein provide enhanced integrated circuit (IC) devices. In an embodiment, an IC device includes a substrate, an IC die coupled to a surface of the substrate, a first wirelessly enabled functional block located, on the IC die, the first wirelessly enabled functional block being configured to wirelessly communicate with a second wirelessly enabled functional block located on the substrate, and a ground ring configured to provide electromagnetic shielding for the first and second wirelessly enabled functional blocks.