Clad Metal Wireless IC Card Structure for Bending and RF Interference
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Solution Overview
Problem
Existing metal cards, including those with wireless ICs, face issues such as vulnerability to bending, poor durability, corrosion, and reduced communication performance due to radio interference from metal materials. Additionally, processing challenges and design limitations hinder the creation of high-quality, aesthetically pleasing metal cards that effectively convey the weight and durability of metal.
Innovation Solution
A wireless IC metal card with a clad metal structure formed by bonding multiple metal layers, including a first metal layer with a wireless IC chip, an antenna layer, a second metal layer, and a third metal layer. This configuration enhances durability, corrosion resistance, and communication performance while allowing for easier processing and design aesthetics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a thin-film metal sheet or metal powder coating is used to manufacture a metal card, then the card has a metallic appearance, but the card becomes vulnerable to bending and has poor durability such as corrosion
Solution Approach 1:
The patent applies composite materials by bonding multiple metal layers together to form a clad metal structure. This structure combines different metal layers to achieve both metallic appearance and improved durability, overcoming the limitations of thin-film metal sheets and metal powder coatings that are vulnerable to bending and corrosion.
2Strength
If duralumin is used as the surface material for the metal card, then the card has high strength and lightweight characteristics, but the manufacturing cost increases and processing becomes difficult
Solution Approach 1:
The patent segments the metal card into multiple bonded metal layers, with each layer potentially having different properties optimized for specific functions. This segmentation allows the use of more processable materials in certain layers while maintaining overall structural strength, reducing the manufacturing difficulties associated with using duralumin throughout the entire card structure.
3Weight of moving object
If a wireless IC card is composed of metal material, then the card has metal weight and appearance, but communication performance is reduced due to radio interference from the metal material
Solution Approach 1:
The patent applies local quality by creating regions with different metal densities and compositions within the clad metal structure. Certain layers or regions are optimized for weight and appearance, while other regions are designed to minimize radio interference, allowing the card to maintain metal characteristics while improving communication performance.
4Weight of moving object
If duralumin is used for the metal card surface, then the card is lightweight, but it is difficult to provide the weight of actual metal, making it difficult to distinguish from plastic cards
Solution Approach 1:
The patent uses composite materials with varying densities in different layers of the clad metal structure. By combining lighter and heavier metal layers, the card achieves an optimized weight that provides the characteristic metal feel and distinction from plastic cards, while still being lighter than solid metal cards.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The clad metal structure provides a high-quality metal card that is durable, corrosion-resistant, and effectively conveys the weight of metal, while also overcoming communication limitations and facilitating design aesthetics. This configuration improves processing efficiency and reduces defect rates, resulting in a more reliable and aesthetically pleasing metal card.
Implementation Method 1
the first metal layer, the second metal layer, and the third metal layer are bonded to one another to form a clad metal structure
Data Source
Figure 1
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Figure 3(a)~3(b)
AI summary
A wireless IC metal card according to an embodiment of the present disclosure may include a first metal layer that receives a wireless IC chip on a top surface thereof; an antenna layer disposed in a partial region of a bottom surface of the first metal layer and electrically connected to the wireless IC chip; a second metal layer disposed below the first metal layer, with the antenna layer interposed therebetween; and a third metal layer disposed below the second metal layer, wherein the first metal layer, the second metal layer, and the third metal layer are bonded to one another to form a clad metal structure.