Wireless IC Device Metal Article Radiator RFID

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Solution Overview

Problem

Existing RFID systems face challenges in manufacturing cost and structural integrity due to complex structures and material differences between metal articles and nonmetal plates, leading to increased costs and potential application distortions.

Innovation Solution

A wireless IC device design that utilizes the metal article as a radiator, eliminating the need for additional components and structures, and employs an electromagnetically coupled module for impedance matching and flexible antenna arrangement, allowing the metal article to function as both a radiator and antenna, enhancing radiation characteristics and design flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a nonmetal plate is used to cover the recessed portion, then the IC tag can be secured, but the manufacturing cost increases and application distortion occurs

Engineering Contradiction:
ImproveIC tag securingVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the nonmetal plate component entirely from the structure. Instead of using a separate nonmetal plate to cover the recessed portion, the invention uses the metal article's own surface features (protrusion and recess) directly to secure the IC tag, eliminating the need for additional nonmetallic materials and reducing manufacturing complexity

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the securing function and the structural function into a single integrated metal structure. The protrusion and recess features are formed directly on the metal article, merging the previously separate functions of the metal article (structural component) and the nonmetal plate (securing component) into one unified structure

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If a nonmetal plate is used to cover the recessed portion, then the IC tag can be secured, but cracks or fractures may occur due to thermal expansion differences

Engineering Contradiction:
ImproveIC tag securingVSAvoidstructural integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent uses the same metal material for both the article body and the securing features (protrusion and recess). This homogeneous material composition eliminates the thermal expansion coefficient mismatch that occurs between dissimilar materials like metal articles and nonmetal plates, preventing cracks and fractures at the interface

Inventive Principle:
Principle #33Homogeneity

3Ease of operation

If an antenna pattern is formed for the IC tag, then the IC tag can operate, but the manufacturing process becomes more complex

Engineering Contradiction:
ImproveIC tag operationVSAvoidmanufacturing process
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent makes the metal article serve multiple functions: it acts as both the structural component and the antenna. By utilizing the metal article's inherent electrical conductivity and physical structure, the invention eliminates the need for separate antenna patterns, reducing manufacturing steps while maintaining RFID operational capability

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The metal article itself provides the antenna function without requiring additional components or complex patterning processes. The article's own metallic structure is utilized to generate the necessary electromagnetic field, allowing the IC tag to operate using the article's inherent properties rather than requiring separately manufactured antenna elements

Inventive Principle:
Principle #25Self-service

4Reliability

If additional components and structures are used, then the IC tag can be secured, but the manufacturing process becomes longer

Engineering Contradiction:
ImproveIC tag securingVSAvoidmanufacturing speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent removes the nonmetal plate component from the assembly process. By eliminating this additional component, the manufacturing process is simplified to involve only the metal article and the IC tag, reducing the number of steps required and increasing production speed

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the structural and securing functions into a single metal article structure with integrated protrusion and recess features. This merging eliminates the need for separate assembly steps involving nonmetal plates, streamlining the manufacturing process and improving productivity

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces manufacturing costs, improves radiation characteristics, and allows for efficient energy transmission and reception in RFID systems, while maintaining durability and flexibility in antenna design, even when articles are stacked.

Implementation Method 1

utilizes the metal article as a radiator, eliminating the need for additional components and structures

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Implementation Method 2

employs an electromagnetically coupled module for impedance matching and flexible antenna arrangement

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentEP2166617B1Wireless IC device
Publication Date: 2015.09.30 MURATA MFG CO LTD
  • EP2166617B1 patent drawingFigure 1
  • EP2166617B1 patent drawingFigure 2~3
  • EP2166617B1 patent drawingFigure 4

AI summary

A wireless-IC-device main part (6) is disposed on a surface opposite a surface for receiving signals from a reader/writer. The wireless-IC-device main part (6) has an insulating substrate, which is provided with a loop electrode (7) and an electromagnetically coupled module (1) coupled to the loop electrode (7). A signal (magnetic field Ho) from the reader/writer causes an eddy current J to flow across a conductor principal plane of a metal article (60). The eddy current J causes a magnetic field Hi to be generated in a direction perpendicular to the conductor principal plane of the metal article (60). Then, the loop electrode 7 is coupled to the magnetic field Hi. Thus, the wireless-IC-device main part (6) functions as an RFID tag even for signals from the principal plane opposite the wireless-IC-device main part (6). It is thus possible to reduce cost of manufacturing a metal article, and provide a wireless IC device using the metal article as a radiator.