Wireless IC Module Notch Structure for Pre-Embedding Defect Screening
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Solution Overview
Problem
Defective wireless IC modules embedded in wireless IC cards cannot be visually identified before final functional inspection, leading to potential release of non-functional products into the market.
Innovation Solution
A wireless IC module design featuring a base substrate with an identification area and connection lines that can be cut to form a notch, or an antenna terminal with a slit, allowing for electrical separation of connection points to visually identify defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wireless IC module is embedded in a wireless IC card, then the module can perform wireless operations, but defective modules cannot be visually identified before final inspection
Solution Approach 1:
The patent applies preliminary action by forming a notch in the antenna terminal during manufacturing before the module is embedded in the card. This notch serves as a visual identifier for defective modules, allowing quality control personnel to identify and remove defective products before they reach the final customer, thus solving the problem of invisible defects in embedded modules.
Solution Approach 2:
The patent uses the antenna terminal as an intermediary element to convey defect information. By forming a notch in this accessible component, the defect status of the embedded module can be visually communicated without requiring the module to be extracted from the card, thus maintaining reliability while avoiding increased device complexity.
2Loss of information
If a notch is formed to identify defective products, then visual identification is enabled, but electrical connection between IC chip and antenna terminal is interrupted
Solution Approach 1:
The patent applies local quality by forming the notch only in specific regions of the antenna terminal that do not affect the electrical connection between the IC chip and antenna terminal. The notch is positioned in areas such as the ground portion or non-critical signal paths, allowing visual identification of defective modules while maintaining functional electrical connections for operational modules.
Solution Approach 2:
The antenna terminal is segmented into functional regions (signal paths requiring electrical connection) and identification regions (where notches can be formed). This segmentation allows the notch to serve its identification purpose without compromising the electrical integrity of critical connection paths.
3Productivity
If defective modules are not identified before embedding, then manufacturing efficiency is maintained, but defective products may be released to the market
Solution Approach 1:
The patent performs defect identification preparation (notch formation capability) during manufacturing before embedding, enabling quality control to be performed after embedding without requiring module extraction. This preliminary preparation maintains manufacturing throughput while preventing defective products from reaching customers through post-embedding visual inspection.
Solution Approach 2:
The defective module itself provides the identification feature through the notch formed in its antenna terminal. This self-identifying characteristic allows quality control personnel to identify and remove defective modules without requiring complex external testing equipment or module extraction, thus maintaining productivity while preventing defective product release.
Data Source
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AI summary
A wireless IC module according to an embodiment comprises a base substrate, a pair of antenna terminals that are formed on the base substrate and to which an antenna is connected, an IC chip mounted on the base substrate, a first connection line that connects the IC chip and one antenna terminal of the pair of antenna terminals, and a second connection line that connects the IC chip and the other antenna terminal of the pair of antenna terminals. The base substrate has an identification area where a notch for identification of a defective product is formed, and the first connection line is provided across the identification area such that the first connection line is cut when the notch is formed.