Wireless IC Device Resonance Stabilization via Multilayer Power Board
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Solution Overview
Problem
Existing wireless IC devices face challenges in maintaining stable frequency characteristics due to the difficulty in precisely positioning small wireless IC chips on large plastic films and changes in resonance frequency caused by curling or being sandwiched between dielectric materials.
Innovation Solution
A wireless IC device design where the frequency of transmission and reception signals is determined by a power feeding circuit board, allowing for precise mounting of the IC chip and maintaining stability regardless of the shape or position of the radiating plate, using a distributed or lumped constant resonance circuit and a multilayer board configuration to improve resonance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the wireless IC chip is mounted on the plastic film using a Au bump, then the wireless IC device can be assembled, but it is very difficult to mount the small wireless IC chip in place on the large plastic film
Solution Approach 1:
The patent introduces a mounting structure that includes a mounting portion on the plastic film and a corresponding mounting structure on the wireless IC chip. This intermediary mounting mechanism facilitates precise positioning and assembly by providing complementary mounting features that guide and secure the chip in the correct location, thereby resolving the difficulty of mounting small chips on large films.
2Ease of manufacture
If the wireless IC chip is mounted out of position on the plastic film, then assembly is simplified, but the resonance frequency properties of the antenna disadvantageously change
Solution Approach 1:
The patent incorporates a mounting structure with mounting portions and mounting features that are pre-designed and pre-positioned on the plastic film and wireless IC chip respectively. This preliminary action ensures that when assembly occurs, the chip is automatically guided to the correct position, preventing misalignment that would affect resonance frequency properties while maintaining assembly simplicity.
3Adaptability or versatility
If the antenna pattern is curled or sandwiched between dielectric materials, then the wireless IC device can be flexibly applied, but the resonance frequency properties of the antenna change
Solution Approach 1:
The patent introduces a frequency adjustment mechanism that can modify the resonance frequency of the antenna pattern. When the antenna is curled or sandwiched between dielectric materials, this mechanism adjusts the resonance frequency parameters to compensate for the environmental changes, thereby maintaining stable resonance frequency properties while allowing flexible application forms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable frequency characteristics even when the device is curled or inserted between dielectric materials, enabling precise positioning and improved radiation efficiency while minimizing external electromagnetic interference.
Implementation Method 1
the frequency of a transmission signal radiated from the radiating plate and the frequency of a reception signal supplied to the wireless IC chip are substantially determined on the basis of the resonance frequency of the power feeding circuit included in the power feeding circuit board
Data Source
Figure 1~3
Figure 4
Figure 5(A)~5(B)
AI summary
A wireless IC device comprises a wireless IC chip (5), a power supply circuit board (10) connected to the wireless IC chip and including a power supply circuit having a resonance circuit having a predetermined resonance frequency, and a radiation plate (20) arranged to perform at least one of radiation of a transmission signal supplied from the power feeding circuit, and receiving of a reception signal and supplying the reception signal to the power feeding circuit. The power supply circuit board is a multilayer board made of a plurality of dielectric layers or magnetic layers. The power supply circuit board is provided with a second board-side electrode pattern, and the power supply circuit board is connected to the radiation plate by DC connection between the second board-side electrode pattern and the radiation plate.