Wireless IC Tag on Container Neck with Segmented Metal Cap Seal
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Solution Overview
Problem
The metal cap seal used in containers with wireless IC tags can deteriorate the communication characteristics of the IC tag due to the induced current from the metal cap seal, causing interference with the electromagnetic field and potentially damaging the IC chip during attachment.
Innovation Solution
The wireless IC tag is configured with the IC chip and jumper wire exposed from the cap seal, minimizing pressure-induced deformation and interference, and the cap seal is designed to reduce inductance by interrupting the conductive path, thus maintaining communication quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal cap seal is used to cover the container opening, then the cap seal provides structural strength and sealing function, but the metal cap seal forms a closed annular conductive path that generates induced current and deteriorates the communication characteristics of the wireless IC tag
Solution Approach 1:
The cap seal is divided into multiple segments in the circumferential direction, with insulating sections positioned between metal sections. This segmentation interrupts the closed annular conductive path, preventing induced current generation while maintaining the structural strength and sealing function of the metal portions.
Solution Approach 2:
Insulating sections are introduced as intermediary elements between the metal sections of the cap seal. These insulating sections break the electrical continuity of the metal cap seal, eliminating the harmful induced current effect on the wireless IC tag communication while allowing the metal sections to provide mechanical strength.
2Strength
If the cap seal is made of metal and applied with pressure to fit onto the container, then the cap seal provides durability and secure attachment, but the pressure causes deformation and functional degradation of the IC chip
Solution Approach 1:
The IC chip is extracted from the cap seal structure and positioned on the container body instead. This separation removes the IC chip from the high-pressure zone during cap seal attachment, protecting it from deformation and functional degradation while the metal cap seal maintains its durability and secure attachment capability.
3Device complexity
If the IC chip is positioned on the cap seal, then the wireless IC tag structure is compact and integrated, but the IC chip is exposed to pressure during cap seal attachment causing functional degradation
Solution Approach 1:
The IC chip is extracted from the cap seal and repositioned on the container body. This spatial redistribution reduces device integration but ensures IC chip functionality by removing it from the pressure zone during cap seal attachment.
Solution Approach 2:
The IC chip positioning is moved from the vertical dimension (on the cap seal) to a different spatial location (on the container body). This dimensional change in positioning protects the IC chip from attachment pressure while maintaining overall system functionality.
4Ease of manufacture
If the cap seal is made of shrink film and heated to shrink onto the container, then the cap seal provides flexible fitting and sealing, but the heat exposure alters the quality of heat-sensitive contents such as wine
Solution Approach 1:
The thermal shrinking process is replaced with a mechanical pressing process. The cap seal is fitted onto the container by applying pressure rather than heat, eliminating thermal exposure to the contents while achieving secure fitting and sealing through mechanical force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the deterioration of communication characteristics and reduces the risk of IC chip damage, ensuring reliable communication and functionality of the wireless IC tag.
Implementation Method 1
the cylindrical member is then heated to shrink it so that the cap seal is fitted onto the container
Implementation Method 2
the top face made of metal and the wireless IC tag are overlapped with each other, and the wireless IC tag is positioned on the center axis of the coil. As a result, an induced current passing through the coil causes varying electromagnetic fields
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
A container with a wireless IC tag includes: a container having a container body (30) and a sealing member (32) for sealing an opening portion of the container body (30); and a wireless IC tag (10) and a cap seal (20) attached to the container. The container body (30) includes a neck (31) extending from the opening portion. The wireless IC tag (10) includes an antenna (12) for contactless communication, a wiring (16) for wire break detection, and an IC chip (13) connected to the antenna (12) and the wiring (16). The cap seal (20) includes a cylindrical member (21) that surrounds the neck (31), the cylindrical member (21) having a metal section (21a) disposed on a side face of the neck (31). The wireless IC tag (10) is disposed to extend between opposite lateral sides of the neck (31) via the sealing member (32) and is partially sandwiched between the neck (31) and the cylindrical member (21) with the IC chip (13) being exposed from the cap seal (20).