Wireless Interconnects in Interposer Substrates

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current semiconductor device configurations with interposers suffer from signal delays and signal loss due to long electrical connections between dies, requiring complex routing designs that result in thick devices.

Innovation Solution

Incorporating a wireless interconnect in the interposer using a substrate with passive devices, such as inductors, that inductively couple through substrate vias to reduce signal loss and delay, allowing for thinner devices with high bandwidth communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If long electrical connections are used in the interposer, then routing flexibility is improved, but signal loss and signal delay increase

Engineering Contradiction:

Improverouting flexibilityVSAvoidsignal loss

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent replaces the traditional electrical connection system (mechanical/electrical fields) with a wireless communication system using electromagnetic waves. This substitution eliminates the need for long physical interconnects while maintaining routing flexibility through wireless signal transmission, thereby reducing signal loss and delay associated with long electrical connections.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces wireless communication modules as intermediary components between dies, replacing direct electrical connections. These modules transmit data wirelessly through the interposer substrate, acting as mediators that eliminate the need for long physical interconnects while maintaining communication functionality and reducing signal degradation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If long electrical connections are used in the interposer, then routing flexibility is improved, but signal delay increases

Engineering Contradiction:

Improverouting flexibilityVSAvoidsignal delay

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent replaces the electrical signal transmission system with a wireless electromagnetic communication system. This substitution enables faster signal propagation through wireless channels compared to long physical interconnects, reducing signal delay while maintaining routing flexibility through the wireless communication architecture.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The wireless communication modules serve as intermediaries that transmit data between dies without requiring long physical electrical paths. This intermediary approach reduces signal transit time by utilizing wireless electromagnetic transmission, thereby decreasing signal delay while preserving routing adaptability.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If complex routing designs are used, then connection flexibility is improved, but device thickness increases

Engineering Contradiction:

Improveconnection flexibilityVSAvoiddevice thickness

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent replaces the multi-layer electrical routing system with a wireless communication system. This substitution eliminates the need for multiple thick routing layers in the interposer, as wireless signals can penetrate or transmit through the substrate without requiring complex physical interconnect structures, thereby reducing device thickness while maintaining connection flexibility.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The wireless communication modules act as intermediaries that enable flexible connections between dies without requiring thick physical routing layers. By transmitting signals wirelessly through the interposer substrate, the system achieves connection flexibility while minimizing the vertical space occupied by routing structures, thus reducing overall device thickness.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The wireless interconnect solution effectively minimizes signal loss and delay, enabling thinner semiconductor devices with high bandwidth communication by reducing the need for complex routing layers.

Implementation Method 1

The second passive device is configured to inductively couple to the first passive device

Methodology Applied

Scientific EffectElectromagnetic Induction: Electromagnetic Induction

Data Source

PatentUS9165791B2Wireless interconnects in an interposer

Publication Date: 2015.10.20 QUALCOMM INC

AI summary

Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.