Wireless Device Interposer Antenna Warpage Reduction
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Solution Overview
Problem
Conventional semiconductor packages with built-in slot antennas face warpage issues due to differences in metal coverage rates among conductor layers, leading to defects during manufacturing processes such as reflow and resin sealing, which affect the antenna characteristics and overall package reliability.
Innovation Solution
The wireless device design features symmetrically positioned conductor layers with equal area antenna patterns and overlapping openings, maintaining comparable metal coverage rates and reducing warpage while preserving excellent antenna characteristics by using a grounded coplanar line and avoiding dummy patterns within the antenna areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a slot antenna is formed as an opening in a conductor pattern of a conductor layer, then the antenna function is achieved, but a relatively large space must be secured and the interposer becomes susceptible to warpage due to differences in metal coverage rates
Solution Approach 1:
The patent transitions from forming a slot antenna in a single conductor layer to using openings in both upper and lower conductor layers of the interposer. This dimensional extension allows the antenna function to be distributed across multiple layers, reducing the space requirement in any single layer and balancing the metal coverage rates to minimize warpage.
Solution Approach 2:
The patent applies different patterns to different conductor layers: the upper conductor layer has a first pattern with first openings, while the lower conductor layer has a second pattern with second openings. This local differentiation allows optimization of antenna performance in each layer while maintaining overall structural stability and reducing warpage through balanced metal distribution.
2Stability of the object's composition
If dummy patterns are added to balance metal coverage rates, then warpage is reduced, but the antenna characteristics are degraded
Solution Approach 1:
The patent extracts the warpage reduction function from dummy patterns and implements it through the strategic placement of functional openings in both upper and lower conductor layers. The antenna openings themselves are configured to balance metal coverage rates, eliminating the need for separate dummy patterns that would degrade antenna characteristics.
Solution Approach 2:
The openings in the conductor layers serve dual purposes: they create the slot antenna structure for electromagnetic wave transmission while simultaneously balancing the metal coverage rates across layers to reduce warpage. This multi-functionality eliminates the conflict between antenna performance and structural stability.
3Productivity
If multiple interposers are arranged on a single substrate for manufacturing, then productivity is improved, but warpage accumulates and causes defects during reflow and resin sealing processes
Solution Approach 1:
The patent reduces warpage at the source by distributing antenna openings across multiple conductor layers, creating a more balanced metal coverage structure. This dimensional approach to antenna design inherently minimizes warpage, allowing multiple interposers to be arranged and processed without cumulative warpage causing manufacturing defects.
Data Source
AI summary
According to an embodiment, a wireless device includes an interposer, a semiconductor chip, and a non-conductor. The interposer comprises a plurality of conductor layers. The semiconductor chip is mounted on the interposer and comprising a built-in transceiver circuit. The non-conductor is placed on the interposer and seals the semiconductor chip. From among the plurality of conductor layers, a first conductor layer and a second conductor layer are symmetrically positioned with respect to center in a thickness direction of the interposer respectively have a first antenna conductor pattern and a second antenna conductor pattern. The first antenna conductor pattern and the second antenna conductor pattern respectively have a first opening and a second opening functioning as a slot antenna and have substantially equal area of a conductor portion. An orthogonal projection of the first opening onto the second conductor layer overlaps with the second opening.