Wireless Josephson Amplifier Integration Without Wire-Bond Loss
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Solution Overview
Problem
Integration of Josephson amplifiers into quantum electrodynamics systems is challenging due to the need for interconnects between different microwave environments, leading to losses and reduced measurement efficiency, as well as limited tunability and performance.
Innovation Solution
A wireless Josephson-junction-based circuit that amplifies microwave signals without physical electrical connections, using micro-antennas integrated onto a chip and careful placement within a microwave waveguide, reducing the number of components and eliminating losses associated with traditional interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional Josephson amplifiers are integrated into quantum electrodynamics systems using wire-bonded interconnects and microwave components, then the amplifier can be connected to the microwave environment, but losses are introduced that reduce measurement efficiency and fidelity
Solution Approach 1:
The patent removes the problematic wire-bonded interconnects and discrete microwave components from the system by integrating the antenna directly onto the superconducting chip substrate. This extraction eliminates the sources of microwave signal loss and measurement inefficiency while maintaining the necessary coupling between the amplifier and the microwave environment.
Solution Approach 2:
The patent combines the antenna and the superconducting amplifier circuit onto a single integrated chip substrate. This merging eliminates the need for separate interconnects and discrete components, reducing microwave signal loss and improving measurement efficiency while maintaining all necessary functions.
2Ease of operation
If wire-bonded interconnects and discrete microwave components are used to connect Josephson amplifiers to the microwave environment, then electrical connections can be established, but the system complexity increases with additional components
Solution Approach 1:
The patent merges the antenna and amplifier circuit onto a single integrated chip substrate, eliminating the need for separate wire-bonded interconnects and discrete microwave components. This integration simplifies the overall system architecture and reduces the number of components while maintaining all necessary functions.
Solution Approach 2:
The patent removes the complex wire-bonded interconnect structure and discrete microwave components from the system by extracting their functions and integrating them directly onto the chip substrate, thereby reducing system complexity.
3Adaptability or versatility
If traditional interconnects and microwave components are used in Josephson amplifier systems, then electrical connections can be made, but undesirable losses and complicated frequency dependence of impedances result
Solution Approach 1:
The patent combines the antenna and amplifier onto an integrated chip substrate, creating a unified structure that eliminates the frequency-dependent impedance issues and signal losses associated with separate interconnects and discrete components. The integrated design provides better impedance matching and reduced losses across the operating bandwidth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wireless amplifier achieves comparable gain and bandwidth to conventional Josephson amplifiers while offering improved dynamic range, tunability, and efficiency, with the potential for mass production and integration into 3D circuit quantum electrodynamics systems.
Implementation Method 1
Josephson-junction-based amplifiers for detection and processing of qubits
Implementation Method 2
Interaction of the amplifier with the microwave environment is achieved wirelessly by one or more micro-antennas integrated onto a chip
Data Source
AI summary
A wireless Josephson-junction-based amplifier is described that provides improved tunability and increased control over both a quality factor Q and participation ratio p of the amplifier. The device may be fabricated on a chip and mounted in a waveguide. No wire bonding between the amplifier and coaxial cables or a printed circuit board is needed. At least one antenna on the chip may be used to couple energy between the waveguide and wireless JBA. The amplifier is capable of gains greater than 25 dB.