Wireless LED Light Module Layout for Heat Dissipation and Isolation
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Solution Overview
Problem
Existing lighting devices using LED light sources face challenges in efficiently managing heat dissipation and wireless communication while maintaining electrical isolation and noise reduction, which affects performance and functionality.
Innovation Solution
A lighting device design featuring a heat sink structure with a thermally conductive module heat sink and housing heat sink, along with an insulator and antenna configuration that includes capacitive coupling and electrical isolation, to manage heat and wireless communication effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink structure is added to manage heat dissipation, then thermal management performance is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat sink with the housing structure, where the housing serves dual purposes as both structural enclosure and thermal dissipation component. The heat sink is integrated into the housing design, eliminating the need for separate heat sink and housing parts, thus improving thermal management while minimizing additional structural complexity.
Solution Approach 2:
The housing structure is designed to perform multiple functions: providing structural support, electrical isolation, and heat dissipation. The heat sink is designed to both cool the LED module and serve as a mounting structure for the wireless communication circuit board, reducing the overall number of components needed.
2Object-affected harmful factors
If electrical isolation measures are implemented between heat sink and circuit board, then noise reduction is improved, but device complexity increases
Solution Approach 1:
The patent introduces an insulator as an intermediary component between the heat sink and the wireless communication circuit board. This insulator provides electrical isolation to prevent noise interference while allowing thermal contact through thermal paste or pads. The insulator is a simple, thin component that adds minimal complexity while effectively addressing the noise issue.
3Temperature
If thermal contact between heat sink and emitter module is enhanced, then heat dissipation is improved, but electrical isolation may be compromised
Solution Approach 1:
The patent applies different material properties to different locations: the heat sink uses thermally conductive material to maximize heat transfer from the LED module, while the insulator layer uses electrically insulating but thermally conductive material (such as ceramic or metal oxide) to provide electrical isolation while maintaining thermal contact. This local differentiation of material properties resolves the contradiction between thermal efficiency and electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation and reduces noise interference, improving the performance and reliability of LED lighting devices by optimizing thermal management and wireless signal transmission.
Implementation Method 1
a heat sink located between the first printed circuit board and the second printed circuit board. The emitter module may be thermally-coupled to the heat sink through the substrate and the first printed circuit board
Implementation Method 2
The light-generation module may comprise an insulator received in a recess in a rear surface of the heat sink. The insulator may be configured to electrically isolate the drive circuit, the control circuit, and the wireless communication circuit from the heat sink
Implementation Method 3
a wireless communication circuit configured to communicate wireless signals
Implementation Method 4
The heat sink may comprise a coupling portion configured to be capacitively coupled to a ground plane of the second printed circuit board
Data Source
AI summary
A lighting device (e.g., a controllable light-emitting diode illumination device) may have a light-generation module that may be assembled and calibrated prior to the light-generation module being installed in a finished good. The light-generation module may include an emitter module having at least one emitter mounted to a substrate and configured to emit light. The light-generation module may include a first printed circuit board on which the emitter module may be mounted and a second printed circuit board on which those circuits that are essential for powering the emitter module may be mounted. The light-generation module may include a heat sink located between the first printed circuit board and the second printed circuit board. The emitter module may be thermally-coupled to the heat sink through the substrate and the first printed circuit board.