Wireless Communication Module Antenna Circuit Board Flatness Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wireless communication modules using ceramic antenna circuit boards suffer from dielectric loss and instability in radiation characteristics at high-frequency bands due to material flexibility and heat-generated deformation, leading to unstable antenna performance.
Innovation Solution
A wireless communication module design featuring a flexible antenna circuit board with a support structure that maintains the board's flatness and incorporates a heat diffusing plate or heat pipe to manage heat and prevent deformation, ensuring stable radiation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a ceramic antenna circuit board is used, then dielectric loss is reduced, but the board becomes inflexible and has poor processability
Solution Approach 1:
The patent changes the material parameter from ceramic to flexible material (polyimide resin or liquid crystal polymer) to improve processability and flexibility, while accepting the trade-off of increased dielectric loss. This is a direct parameter change to resolve the contradiction between energy loss and manufacturability.
2Ease of manufacture
If a flexible antenna circuit board is used, then processability is improved, but radiation characteristics become unstable due to deformation
Solution Approach 1:
The patent applies preliminary anti-action by providing a support structure that prevents deformation of the flexible antenna circuit board before the board can deform and affect radiation characteristics. The support acts in advance to counteract the potential harmful deformation that would occur during operation.
3Power
If heat generation from integrated circuit increases, then processing capability improves, but antenna circuit board deforms and radiation characteristics become unstable
Solution Approach 1:
The patent introduces a support as an intermediary element between the integrated circuit and the antenna circuit board. This support structure mediates the thermal interaction by providing mechanical support to prevent deformation while allowing heat to be managed, thus protecting the radiation characteristics from the heat generation of the integrated circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents radiation characteristic changes due to deformation and reduces heat-related instability, maintaining desired antenna performance even at high-frequency bands.
Implementation Method 1
a heat diffusing plate, provided on the region of the first principal surface, which diffuses heat generated by the integrated circuit
Implementation Method 2
a support joined to a pair of opposite sides of the second principal surface of the antenna circuit board so as to keep the antenna circuit board flat
Data Source
Figure 1(a)~1(b)
Figure 2(a)~2(b)
Figure 3(a)~3(b)
AI summary
To provide a wireless communication module capable of preventing radiation characteristics from being changed by deformation of an antenna circuit board, a wireless communication module (1) includes an antenna circuit board (11) having a first principal surface (1111) on which at least one antenna element (114_j) is mounted and a second principal surface (1112) on which an integrated circuit (115) is mounted. The wireless communication module (1) includes a support (12) that holds the antenna circuit board (11) by being in contact with a pair of opposite sides thereof and that thereby keeps the antenna circuit board (11) flat. The support (12) either (i) faces the second principal surface (1112) and is separated from the second principal surface (1112) by a distance that is not smaller than the wavelength of an electromagnetic wave transmitted and received with use of the antenna circuit board (11) or (ii) does not face the second principal surface (1112).