Wireless Communication Module Antenna Ground Layer Design
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Solution Overview
Problem
Existing wireless communication modules face challenges in effectively shielding high-frequency devices and arranging antenna and ground conductors in a multilayer manner, particularly for millimeter-wave antennas, which affects radiation efficiency and stability.
Innovation Solution
A wireless communication module design featuring a dielectric substrate with a ground layer, an antenna pattern closer to the surface, and projecting signal and ground conductor columns that connect to a high-frequency device, with a sealing-resin layer and frame-shaped substrate for enhanced mechanical support and radiation blocking, allowing for improved antenna gain and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the high-frequency device is mounted on the dielectric substrate without additional shielding structures, then the device complexity is reduced, but unnecessary radiation from the high-frequency device cannot be blocked
Solution Approach 1:
The ground layer is integrated directly into the dielectric substrate, merging the shielding function with the substrate structure. This eliminates the need for separate shielding components while effectively blocking unnecessary radiation from the high-frequency device.
Solution Approach 2:
The ground layer serves multiple functions simultaneously: it acts as a reference plane for the antenna pattern, provides shielding to block radiation, and establishes electrical connection. This multi-functionality reduces overall device complexity while achieving effective radiation control.
2Reliability
If the antenna pattern and ground conductor are arranged in a multilayer manner, then the antenna gain is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent transitions from planar antenna-ground conductor arrangement to a three-dimensional multilayer configuration. The antenna pattern is positioned on one surface of the dielectric substrate while the ground layer is placed on the opposite surface, creating vertical separation that improves antenna gain through better electromagnetic field control.
Solution Approach 2:
The ground conductor columns are embedded within the dielectric substrate, nesting the grounding structure inside the substrate volume rather than placing it on the external surface. This nested arrangement achieves effective grounding and shielding while maintaining a compact overall structure.
3Stability of the object's composition
If ground conductor columns are embedded in the dielectric substrate, then the ground stability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The ground conductor columns are formed within the dielectric substrate before the antenna pattern and other components are assembled. This preliminary formation of the grounding structure ensures precise positioning and stable electrical connection, as the columns are already in place to receive and connect with the ground layer during subsequent assembly steps.
Data Source
AI summary
A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.