Wireless Communication Module Miniaturization via Bottom Surface Pads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wireless communication modules face challenges in miniaturization due to the need to avoid short-circuits between metal covers and conductive pads on the top surface, and the difficulty in visually inspecting the connection quality between conductive contacts and pads on the bottom surface.
Innovation Solution
A wireless communication module design featuring a module board with conductive pads on one surface and electronic components on the other, a carrier with grooves and conductive contacts, and conductive leads interconnecting these contacts, allowing for miniaturization and improved visual inspection of solder connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conductive pads are formed on the top surface of the module board, then the module board size must be increased to avoid short-circuit between metal cover and conductive pads, but this prevents miniaturization of the wireless communication module
Solution Approach 1:
The conductive pads are relocated from the top surface to the bottom surface of the module board, utilizing the z-dimension (vertical dimension) to resolve the spatial conflict. This allows the metal cover on the top surface to be positioned closer to the electronic components without risk of short-circuit, enabling miniaturization while maintaining reliability
2Volume of moving object
If conductive pads are formed on the bottom surface of the module board, then miniaturization is enabled, but the connection quality between conductive contacts and pads becomes difficult to determine by visual inspection
Solution Approach 1:
A carrier is introduced as an intermediary component between the module board and the external environment. The carrier provides a platform with conductive contacts that connect to the conductive pads on the bottom surface, and includes visual indication features (such as windows or transparent portions) that allow inspection of the solder connection quality without requiring direct access to the hidden pads
Data Source
AI summary
A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic component mounted to the second surface; a carrier stacked to the module board and having opposite first and second surfaces and a peripheral end that has a peripheral end face extending between the first and second surfaces of the carrier and formed with multiple spaced apart grooves; multiple spaced apart first conductive contacts formed on the first surface of the module substrate, and contacting a respective one of the module contacts; multiple spaced apart second conductive contacts formed on the second surface of the module substrate; and multiple conductive leads that interconnect the first and second conductive contacts.