Wireless Communication Module With Embedded Conductive Shielding
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Solution Overview
Problem
Conventional wireless communication modules with metal covers to mitigate electromagnetic interference suffer from increased profile and weight, hindering miniaturization.
Innovation Solution
A wireless communication module design featuring a dielectric frame and panel with embedded conductive bodies surrounding the electronic components to prevent electromagnetic interference, eliminating the need for a metal cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal cover is used to eliminate electromagnetic interference, then electromagnetic shielding is improved, but the profile and weight of the module are significantly increased
Solution Approach 1:
The patent divides the shielding function into multiple separate conductive bodies (first conductive bodies and second conductive bodies) that are embedded in the dielectric frame at different locations, rather than using a single continuous metal cover. This segmentation allows shielding effectiveness while reducing overall volume and weight.
Solution Approach 2:
The patent applies conductive bodies only at specific locations where electromagnetic interference is most problematic, rather than covering the entire module with a metal cover. The conductive bodies are strategically positioned at peripheral portions of the dielectric frame to provide localized shielding where needed.
2Object-affected harmful factors
If a metal cover is used to eliminate electromagnetic interference, then electromagnetic shielding is improved, but the weight of the module is significantly increased
Solution Approach 1:
The patent extracts the shielding function from a traditional metal cover structure and implements it through discrete conductive bodies embedded in a dielectric frame. This extraction allows the shielding function to be achieved with significantly reduced weight compared to a solid metal cover.
Solution Approach 2:
The patent uses a composite structure combining dielectric material (frame) with conductive elements (conductive bodies) to achieve electromagnetic shielding. This composite approach provides the necessary shielding performance while maintaining low weight, as the dielectric material provides structural support without the weight penalty of a full metal cover.
3Object-affected harmful factors
If a metal cover is used to eliminate electromagnetic interference, then electromagnetic shielding is improved, but miniaturization of the module is hindered
Solution Approach 1:
The patent merges the shielding function with the structural frame by embedding conductive bodies directly into the dielectric frame. This integration eliminates the need for a separate metal cover component, simplifying the overall structure and enabling miniaturization while maintaining electromagnetic shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively minimizes electromagnetic interference while allowing for the miniaturization of the module by using conductive bodies within a dielectric frame and panel structure.
Implementation Method 1
a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component
Data Source
AI summary
A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component.