Wireless Communication Module Ground Segmentation for Harmonic Isolation
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Solution Overview
Problem
Conventional wireless communication modules face performance limitations due to harmonic components of RF signals propagating through the ground and interfering with other components, leading to reduced efficiency and increased unnecessary radiation.
Innovation Solution
A wireless communication module with a layered substrate featuring a groove between the power amplifier and filter, and a shield grounded to a separate ground layer, which electrically isolates components and reduces harmonic signal penetration and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If components are arranged closely on the substrate to reduce device size, then area is reduced, but harmonic components of RF signals propagate through the ground and interfere with other components
Solution Approach 1:
The ground layer is segmented into multiple independent ground regions (first ground region and second ground region) that are electrically isolated from each other. The power amplifier is connected to the first ground region while the filter is connected to the second ground region, preventing harmonic signal propagation through the ground between these components.
Solution Approach 2:
Different ground regions are assigned to different functional areas: the first ground region serves the power amplifier area while the second ground region serves the filter area. This localized grounding approach ensures that each component has its own dedicated ground path, reducing electromagnetic interference while maintaining compact layout.
2Device complexity
If a shared ground layer is used to simplify the substrate structure, then device complexity is reduced, but unnecessary radiation increases due to harmonic component propagation
Solution Approach 1:
The ground layer is divided into multiple independent ground regions instead of using a single continuous ground layer. This segmentation prevents harmonic signals from the power amplifier from propagating through the ground to other components, thereby reducing unnecessary radiation while maintaining relatively simple substrate structure.
3Productivity
If the power amplifier and filter are placed close together to improve signal processing efficiency, then productivity is improved, but harmonic components interfere with the filter performance
Solution Approach 1:
The ground is segmented into separate regions for the power amplifier and filter, allowing these components to be placed close together for efficient signal processing while preventing harmonic interference from the power amplifier from degrading the filter's performance through the ground path.
Solution Approach 2:
The separated ground regions act as an intermediary that allows close placement of the power amplifier and filter for efficient signal processing, while simultaneously preventing harmful harmonic interactions between these two components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the module's performance by minimizing interference from harmonic components and reducing unnecessary radiation, thereby improving overall communication efficiency.
Implementation Method 1
a shield (9) grounded to a ground separated from the power amplifier (7)
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
A wireless communication module with improved performance and a mobile object that is equipped with the wireless communication module with the improved performance are provided. The mobile object is equipped with a wireless communication module 1. The wireless communication module 1 includes a substrate 2, a first element 7, and a second element 8. The substrate 2 includes ground layers 21 and 23. The first element 7 is arranged on the substrate 2 and amplifies an input RF signal. The second element 8 is arranged on the substrate 2 and different from the first element 7. Each of the ground layers 21 and 23 has a groove 26 formed between the first element 7 and the second element 8.