Millimeter-Wave Wireless Module Heat Sink Clamping Structure
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Solution Overview
Problem
Existing wireless modules face issues with heat dissipation efficiency due to variations in the positional relationship between the substrate and housing, particularly when using thin heat dissipation sheets, which can lead to gaps and inadequate heat dissipation from high-temperature elements handling millimeter-wave RF signals.
Innovation Solution
A wireless module design where the cover and case compress a thinner heat dissipation sheet against a protruding heat dissipation part, ensuring contact with high-temperature elements even with substrate warping, and utilizing metal components to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thin heat dissipation sheet is used to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but gaps may be created between the heat dissipation sheet and the substrate or housing due to positional variations, worsening heat dissipation reliability
Solution Approach 1:
The housing is designed with a clamping structure that applies compressive force to the heat dissipation sheet, dynamically maintaining contact pressure between the sheet and the high-temperature element despite substrate warping or positional variations. This dynamic compression ensures reliable thermal contact while allowing the use of thin heat dissipation sheets for improved heat dissipation efficiency.
Solution Approach 2:
The clamping structure pre-compresses the heat dissipation sheet during assembly, establishing initial contact pressure before operation. This preliminary action ensures that the thin heat dissipation sheet maintains consistent thermal contact with the high-temperature element throughout operation, preventing gaps from forming due to subsequent positional variations.
2Loss of energy
If the heat dissipation sheet is made thinner to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but the sheet becomes more sensitive to positional variations, worsening manufacturing precision requirements
Solution Approach 1:
The clamping structure provides dynamic compression that compensates for manufacturing tolerances and substrate warping. By applying continuous compressive force, the system maintains reliable thermal contact even with thinner heat dissipation sheets, reducing the stringency of manufacturing precision requirements while preserving heat dissipation efficiency.
3Reliability
If compression force is applied to maintain contact with the heat dissipation sheet, then heat dissipation reliability is improved, but the clamping force may affect the antenna performance, worsening electromagnetic wave transmission
Solution Approach 1:
The housing is segmented into a clamping portion for compression and a passing section for electromagnetic wave transmission. This segmentation allows the clamping structure to apply compression force to the heat dissipation sheet for reliable thermal contact while the passing section provides an unobstructed path for electromagnetic waves from the antenna, preventing interference between the two functions.
Solution Approach 2:
The compression force is applied locally at the heat dissipation interface between the clamping portion and the heat dissipation sheet, while the passing section maintains electromagnetic wave transmission properties. This localized application of compression ensures that thermal contact is improved without adversely affecting electromagnetic wave transmission through the housing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design maintains effective heat dissipation from high-temperature elements by compressing the heat dissipation sheet, ensuring consistent thermal contact despite positional variations, thus improving overall heat management.
Implementation Method 1
a first heat dissipation sheet 61 is provided between the first heat dissipation part 44 and the first power-feeding element 11 in the opposing direction X
Implementation Method 2
the cover 30 and the case 40 compress the first heat dissipation sheet 61 and the first substrate 10 in the opposing direction X
Implementation Method 3
a first substrate 10 including an antenna A that transmits and receives high-frequency signals in a millimeter-wave band
Data Source
AI summary
A wireless module includes: a first substrate including an antenna that transmits and receives high-frequency signals in a millimeter-wave band, a first high-temperature element that supplies high-frequency signals to the antenna being mounted on the first substrate; and a housing including a cover and a case combined with each other and housing the first substrate, the first substrate is in contact with the cover in an opposing direction in which the case and the cover oppose each other, the case includes a first heat dissipation part protruding toward the first high-temperature element, a first heat dissipation sheet is provided between the first heat dissipation part and the first high-temperature element in the opposing direction, and the cover and the first heat dissipation part compress the first heat dissipation sheet and the first substrate in the opposing direction.