Millimeter-Wave Wireless Module Heat Sheet Compression Layout
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Solution Overview
Problem
Existing wireless modules face challenges in heat dissipation efficiency due to positional variations between the substrate and housing, particularly when using thin heat dissipation sheets, as they may not maintain adequate contact with the high-temperature elements in millimeter-wave band applications.
Innovation Solution
A wireless module design featuring a housing with a cover and case that compresses a thin heat dissipation sheet between the high-temperature element and a protruding heat dissipation part, ensuring contact and efficient heat transfer even if the substrate warps, and utilizing metal components for enhanced heat capacity and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thin heat dissipation sheet is used to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but contact reliability deteriorates due to substrate warping or positional variations
Solution Approach 1:
The patent introduces a pressing mechanism that applies dynamic pressure to the heat dissipation sheet, transforming it from a static rigid structure to a dynamically adjustable component. This allows the sheet to maintain contact under varying conditions while preserving its thin profile for efficient heat dissipation.
Solution Approach 2:
The patent changes the physical state of the heat dissipation sheet by applying pressure, transforming it from a loose, potentially disconnected state to a compressed, firmly contacted state. This parameter change (from uncompressed to compressed) enables the thin sheet to maintain reliable contact without increasing its thickness.
2Loss of energy
If the heat dissipation sheet is made thinner to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but manufacturing precision requirements increase to maintain contact
Solution Approach 1:
The pressing mechanism provides dynamic adjustment capability that compensates for manufacturing tolerances. Instead of requiring extremely precise manufacturing to ensure contact, the system uses mechanical pressure to force contact, thereby reducing the stringency of manufacturing precision requirements while maintaining thin sheet design.
3Loss of energy
If a thin heat dissipation sheet is used, then heat dissipation efficiency is improved, but heat transfer reliability deteriorates when positional relationship varies
Solution Approach 1:
The pressing mechanism creates a dynamic system that actively maintains heat transfer contact despite positional variations. The applied pressure ensures that the thin heat dissipation sheet remains in firm contact with both the power-feeding element and the heat dissipation structure, thereby maintaining reliable heat transfer pathways.
Solution Approach 2:
By changing the compression parameter of the heat dissipation sheet, the patent transforms it from a potentially disconnected state to a firmly contacted state. This compression ensures reliable thermal contact between the thin sheet and the components it connects, maintaining heat transfer reliability despite the reduced thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains effective heat dissipation from high-temperature elements despite positional variations, improves heat transfer efficiency, and reduces the thickness of the heat dissipation sheet while preventing unnecessary radiation leakage.
Implementation Method 1
the heat dissipation sheet absorbs heat from the power-feeding element (i.e., a high-temperature element) and releases the absorbed heat to the housing
Implementation Method 2
the cover and the first heat dissipation part compress the first heat dissipation sheet and the first substrate in the opposing direction
Data Source
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AI summary
A wireless module includes: a first substrate including an antenna that transmits and receives high-frequency signals in a millimeter-wave band, a first high-temperature element that supplies high-frequency signals to the antenna being mounted on the first substrate; and a housing including a cover and a case combined with each other and housing the first substrate, the first substrate is in contact with the cover in an opposing direction in which the case and the cover oppose each other, the case includes a first heat dissipation part protruding toward the first high-temperature element, a first heat dissipation sheet is provided between the first heat dissipation part and the first high-temperature element in the opposing direction, and the cover and the first heat dissipation part compress the first heat dissipation sheet and the first substrate in the opposing direction.