Wireless Module Board Layout for Heat Dissipation and Signal Quality
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Solution Overview
Problem
Existing wireless communication modules face issues with complex wiring layouts and inefficient heat dissipation due to the trapping of heat generated by IC chips between boards, leading to prolonged wiring and increased circuit complexity.
Innovation Solution
A wireless communication module design featuring through-holes in the communication board to allow direct heat dissipation from IC chips, with a heat dissipation sheet and a heat radiating member to enhance thermal conductivity and simplify wiring layouts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large number of through-holes are formed in the communication board to dissipate heat from IC chips, then heat dissipation is improved, but the wiring layout becomes complex and wiring length increases
Solution Approach 1:
The patent applies local quality by forming through-holes only at specific portions of the communication board that face the IC chips, rather than distributing them uniformly across the entire board. This localized approach allows heat dissipation to be concentrated where needed (at the IC chip locations) while minimizing the impact on wiring layout in other areas, thus resolving the contradiction between heat dissipation effectiveness and wiring complexity
Solution Approach 2:
The patent segments the heat dissipation function by creating discrete through-holes at specific locations rather than using a continuous heat dissipation structure. This segmentation allows the wiring layout to be simplified by concentrating through-holes only where IC chips are mounted, separating the heat dissipation function from the general wiring areas and reducing overall wiring complexity
2Temperature
If the band-pass filter is exposed without coverage, then heat dissipation is improved, but signal quality and gain deteriorate
Solution Approach 1:
The patent applies local quality by selectively covering the band-pass filter with the communication board while leaving through-holes at IC chip portions uncovered. This localized differentiation allows the band-pass filter to be shielded for signal quality improvement while IC chips maintain exposure for heat dissipation, thus resolving the contradiction between heat dissipation and signal quality
Solution Approach 2:
The communication board acts as an intermediary structure that simultaneously performs multiple functions: it covers the band-pass filter to improve signal quality while incorporating through-holes at IC chip locations to enable heat dissipation. This intermediary structure mediates between the conflicting requirements of signal shielding and heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies wiring layouts and improves heat dissipation by reducing the number and size of through-holes, allowing efficient heat transfer and preventing temperature rise in the communication board, while maintaining high signal quality and gain.
Implementation Method 1
the heat generated in the frequency converter and the amplifier phase shifter (IC chip) can be released to the outside of the wireless communication module through the through-hole of the communication board through the gap between the wireless module board and the communication board
Implementation Method 2
a heat dissipation sheet having a higher thermal conductivity than a dielectric material of the communication board may be placed on an upper surface of the IC chip facing the through-hole
Data Source
Figure 1~2
Figure 3~4
AI summary
A wireless communication module includes a wireless module board, a frequency converter, an amplifier phase shifter, a band-pass filter, and a communication board, and a through-hole, which penetrates in a direction in which the wireless module board and the communication board are aligned, is formed at a portion of the communication board to which at least one of IC chips of the frequency converter and the amplifier phase shifter faces, and the band-pass filter is covered by the communication board.