Wireless Module In-Plane Terminals for Space-Saving Mounting
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Solution Overview
Problem
Conventional wireless modules require a large space for mounting and restrict the placement of other electronic components due to their surface-mount design, leading to space wastage and limitations in communication quality.
Innovation Solution
A wireless module design featuring a substrate with terminals extending in-plane, allowing for offset antenna placement and dual antennas with different directivities, enabling space-saving mounting and enhanced communication quality by allowing other components to be mounted on both sides of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the wireless module is designed for surface-mounting, then the module can be mounted on a circuit board, but it requires a relatively large space for mounting and prevents other electronic components from being mounted on the reverse surface
Solution Approach 1:
The patent transitions from surface-mounting (two-dimensional mounting on the front surface) to in-plane mounting where terminals extend in the in-plane direction of the substrate. This allows the module to be mounted by connecting terminals that extend along the substrate plane, enabling other components to be placed on both the front and reverse surfaces of the substrate, effectively utilizing three-dimensional space for component arrangement.
2Ease of manufacture
If the wireless module is surface-mounted, then it can be installed on the circuit board, but other electronic components cannot be mounted on the reverse surface of the mount object at the region corresponding to the antenna
Solution Approach 1:
The invention changes the mounting dimension from surface-mounting to in-plane terminal extension, which allows components to be mounted on both surfaces of the substrate without interference. The terminals extend in the in-plane direction, creating spatial separation between the mounting interface and the antenna region, thus enabling versatile component placement on both front and reverse surfaces.
Solution Approach 2:
The substrate is functionally segmented into different regions: one for the antenna (transmitter-receiver) and another for mounting terminals that extend in the in-plane direction. This segmentation allows independent optimization of each region, enabling other electronic components to be mounted on the reverse surface without affecting antenna performance.
3Reliability
If the antenna is positioned on the substrate, then wireless communication function is achieved, but it creates a restriction zone on the reverse surface of the mount object
Solution Approach 1:
The patent positions the antenna on the front surface of the substrate while extending mounting terminals in the in-plane direction. This dimensional arrangement creates spatial separation between the antenna's electromagnetic field zone and the mounting interface, allowing the reverse surface to be utilized for component mounting without degrading communication quality.
Data Source
AI summary
The wireless module according to the present invention includes a wireless IC chip for processing transmission/reception signals, a substrate on which the wireless IC chip is mounted, an antenna provided on the substrate, and a plurality of terminals extending off from the substrate in an in-plane direction of the substrate.