Wireless Module Resin Grinding for Shielding Paste Reduction
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Solution Overview
Problem
The existing manufacturing methods for wireless modules result in uneven resin layers due to the difference in height between electronic components and antennas, leading to excessive use of conductive shielding material, increased costs, and reduced environmental resistance and withstand voltage.
Innovation Solution
A method involving the preparation of a substrate with an electronic component and conductive pattern, followed by applying a resin material, grinding or polishing to flatten the resin layer, and then covering it with a shielding material to form a uniform surface, thereby reducing the amount of shielding material needed and enhancing the module's performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the resin layer is formed by potting or printing method without flattening, then the manufacturing process is simple, but the resin layer surface becomes uneven causing excessive conductive paste usage
Solution Approach 1:
The resin layer surface is flattened by grinding or polishing before applying the conductive paste. This preliminary action creates a uniform surface that prevents excessive paste accumulation in recessed areas, thereby reducing conductive paste consumption while maintaining shielding effectiveness.
2Reliability
If the resin layer thickness is increased in the antenna mounting region to compensate for fluidity, then the resin can better cover the surface, but the resin cure shrinkage increases
Solution Approach 1:
The resin layer is flattened by grinding or polishing before applying the conductive paste. This preliminary action creates a uniform surface that prevents excessive paste accumulation in recessed areas, thereby reducing conductive paste consumption while maintaining shielding effectiveness.
3Productivity
If the squeegee is used for printing the resin layer, then the resin application is efficient, but the height difference between electronic component region and antenna region increases
Solution Approach 1:
The height difference created by squeegee printing is removed by extracting the excess material through grinding or polishing. This process eliminates the uneven surface while preserving the benefits of efficient squeegee application, resulting in a flat surface suitable for uniform conductive paste application.
4Reliability
If conductive paste is applied on uneven resin layer surface, then the shielding material covers all areas, but the paste usage increases and cost rises
Solution Approach 1:
The resin layer surface is flattened by grinding or polishing before applying the conductive paste. This preliminary action creates a uniform surface that prevents excessive paste accumulation in recessed areas, thereby reducing conductive paste consumption while maintaining shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the consumption of expensive conductive paste, minimizes the thickness variations in the resin and shielding layers, and enhances the shielding performance and environmental resistance of the wireless module.
Implementation Method 1
a curing step of curing the resin material to form a resin layer
Implementation Method 2
performing grinding or polishing so as to substantially flatten a surface of the resin layer
Data Source
AI summary
Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.