Wireless Module Resin Segmentation for Antenna Flatness

Solution Overview

Problem

The existing techniques for miniaturizing wireless modules by sealing electronic circuits with resin deteriorate antenna characteristics and cause substrate deformation, leading to mounting issues and reduced yield and reliability.

Innovation Solution

A wireless module design where the resin layer is only formed in the electronic circuit region, with a shielding layer on the resin surface, and the antenna region remains uncovered to prevent deformation and noise interference, while maintaining the module's functionality and flatness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If resin is used to seal the electronic circuit on the substrate, then noise suppression is improved, but antenna characteristics deteriorate and substrate deformation occurs

Engineering Contradiction:

Improvenoise suppressionVSAvoidantenna characteristics

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The substrate surface is divided into a first region (electronic circuit region) and a second region (antenna region). Resin sealing is applied only to the first region, while the second region remains exposed. This segmentation allows noise suppression for the electronic circuit without affecting antenna characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are given different properties: the first region receives resin sealing for noise suppression, while the second region remains uncovered to maintain antenna performance. This local differentiation resolves the contradiction between noise suppression and antenna characteristics.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If resin is used to seal the electronic circuit on the substrate, then noise suppression is improved, but substrate flatness deteriorates

Engineering Contradiction:

Improvenoise suppressionVSAvoidsubstrate flatness

Core Design Contradiction:

Object-affected harmful factorsVSShape

Solution Approach 1:

The substrate surface is divided into a first region (electronic circuit region) and a second region (antenna region). Resin sealing is applied only to the first region, while the second region remains exposed. This segmentation allows noise suppression for the electronic circuit without affecting antenna characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are given different properties: the first region receives resin sealing for noise suppression, while the second region remains uncovered to maintain antenna performance. This local differentiation resolves the contradiction between noise suppression and antenna characteristics.

Inventive Principle:

Principle #3Local quality

3Manufacturing precision

If resin is removed from the antenna part to improve antenna characteristics, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:

Improveantenna part precisionVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The substrate surface is divided into a first region (electronic circuit region) and a second region (antenna region). Resin sealing is applied only to the first region, while the second region remains exposed. This segmentation allows noise suppression for the electronic circuit without affecting antenna characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are given different properties: the first region receives resin sealing for noise suppression, while the second region remains uncovered to maintain antenna performance. This local differentiation resolves the contradiction between noise suppression and antenna characteristics.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the flatness of the substrate, improves antenna performance, and ensures reliable mounting on electronic device motherboards by reducing substrate deformation and noise leakage, thereby increasing yield and reliability.

Implementation Method 1

since resin shrinks at a time of curing, a substrate sometimes fails to maintain its flatness

Methodology Applied

Scientific EffectShrinkage at curing:

Implementation Method 2

a shielding layer formed on a surface of the resin layer and having conductivity

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 3

a conductive pattern formed in the second region on the other face of the substrate and serving as an antenna

Methodology Applied

Scientific EffectElectromagnetic radiation:

Data Source

PatentUS10714822B2Wireless module and method for manufacturing wireless module

Publication Date: 2020.07.14 KAGA FEI CO LTD

AI summary

A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.