Wireless Module Substrate Layout for EMI-Shielded Signal Lines
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Solution Overview
Problem
The existing wireless module configuration leads to electromagnetic coupling between signal lines, causing interference and potential deterioration of baseband and RF signals, particularly when the second signal line is placed on the inner layer of the second substrate.
Innovation Solution
Incorporating a conductor wall or pseudo conductor wall on the first substrate to shield both the first and second signal lines, with the second signal line placed on the surface of the first substrate to reduce electromagnetic coupling and transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the second signal line is provided on the inner layer of the second substrate, then transmission loss is reduced, but electromagnetic coupling between signal lines increases causing interference
Solution Approach 1:
The patent divides the signal transmission paths by separating the first signal line (baseband signal) and second signal line (RF signal) into different spatial locations. The second signal line is moved to the outer surface of the second substrate while the first signal line remains on the first substrate, creating physical segmentation that reduces electromagnetic coupling between the two signal lines.
Solution Approach 2:
The patent transitions the second signal line from an inner layer configuration to an outer surface configuration, changing its dimensional position. This spatial repositioning allows the second signal line to be located on the outer surface of the second substrate, thereby reducing electromagnetic coupling with the first signal line on the first substrate while maintaining transmission efficiency.
2Object-affected harmful factors
If the second signal line is provided on the outer surface of the second substrate, then electromagnetic coupling is reduced, but transmission loss increases
Solution Approach 1:
The patent introduces a ground pattern as an intermediary element between the first signal line and the second signal line. This ground pattern, provided on the outer surface of the second substrate, acts as a shield that reduces electromagnetic coupling between the two signal lines while allowing the second signal line to be positioned on the outer surface for reduced transmission loss.
3Area of stationary object
If signal lines are placed close together for compact design, then device size is reduced, but electromagnetic coupling and signal interference increase
Solution Approach 1:
The patent segments the signal transmission architecture by placing the first signal line on the first substrate and the second signal line on the outer surface of the second substrate. This segmentation allows compact overall device design while maintaining sufficient spatial separation between the baseband signal path and RF signal path, thereby reducing electromagnetic coupling and signal interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces electromagnetic coupling between signal lines, minimizing signal interference and achieving better signal transmission and reception in the millimeter-wave band.
Implementation Method 1
the first substrate is provided with at least one of a conductor wall and a pseudo conductor wall for shielding the one or more first signal lines and the one or more second signal lines
Data Source
AI summary
The present invention reduces an electromagnetic coupling that can occur between a first signal line provided on a first substrate and a second signal line provided on a main surface of a second substrate on the first substrate side. A wireless module (10) includes an RFIC (28), a baseband IC (16), a first substrate (11) on which first signal lines (121 through 126) for transmitting a baseband signal are provided, and a second substrate (21) provided with second signal lines (2201 through 2232) for transmitting an RF signal on a main surface (211). The first substrate (11) is provided with a pseudo conductor wall (post wall 13) for shielding the first signal lines (121 through 126) and the second signal lines (2201 through 2232).