Wireless Module Shielding Without Substrate Grooves
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Solution Overview
Problem
Existing wireless modules face challenges in effectively shielding noise from electronic circuits without compromising the strength of the substrate, as the depth of grooves formed between the electronic circuit and antenna affects noise shielding efficiency and substrate integrity.
Innovation Solution
A wireless module configuration featuring a substrate with an electronic circuit and antenna, sealed with a resin layer and a conductive shielding layer on the surface, where the shielding layer is formed without grooves in the substrate, using a conductive paste applied on the resin layer and connected to a ground layer inside the substrate, ensuring effective noise shielding without reducing substrate strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If grooves are formed in the substrate to increase noise shielding depth, then noise shielding effect is improved, but substrate strength decreases
Solution Approach 1:
The shielding structure is segmented into multiple parts: a first shielding layer on the resin layer, a second shielding layer inside the substrate, and a ground layer. This segmentation allows effective noise shielding without requiring deep grooves that would compromise substrate strength.
Solution Approach 2:
The shielding approach transitions from a single-dimensional deep groove structure to a multi-layered structure distributed across different dimensions and locations, including surface mounting and internal integration, achieving comprehensive shielding without deep substrate penetration.
2Reliability
If resin layer thickness is increased to cover tall electronic components, then electronic circuit sealing is improved, but substrate camber increases
Solution Approach 1:
The shielding layers are strategically positioned in specific regions: the first shielding layer is located where noise radiation is strongest, and the second shielding layer is positioned to provide additional protection. This localized approach provides effective shielding without requiring uniform increases in resin thickness across the entire substrate.
Solution Approach 2:
The shielding structure uses composite material layers including conductive materials and magnetic shielding materials combined with the resin layer, achieving effective noise shielding without increasing the overall thickness of the resin layer that would cause substrate camber.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces noise leakage from the electronic circuit, enhances antenna performance, and maintains the strength of the wireless module by eliminating the need for grooves in the substrate, thus preventing substrate strength degradation.
Implementation Method 1
a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit
Data Source
AI summary
A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.