Wireless Module Package Structure Cavity Resonance Management
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Solution Overview
Problem
Traditional package structures for wireless communication modules suffer from cavity resonance, which lowers the yield of electromagnetic interference (EMI) shielding tests due to enhanced peaks at specific frequencies, despite effective shielding of electromagnetic waves.
Innovation Solution
A package structure with an annular ground pad and an auxiliary ground pad on the substrate, along with a shielding lid featuring an auxiliary ground portion, forms an auxiliary ground pathway to shift the enhanced peak out of the regulated frequency range, improving EMI shielding test yields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a hollow shielding lid is used to shield electromagnetic waves, then electromagnetic interference is reduced, but cavity resonance occurs causing enhanced peaks at specific frequencies
Solution Approach 1:
The patent converts the harmful cavity resonance effect into a beneficial one by strategically placing ground pads and via holes to create artificial resonance paths. These artificial paths redirect the resonance energy away from the problematic frequency range (2.4GHz-5.8GHz) and into controlled grounding paths, effectively using the resonance phenomenon to improve EMI shielding rather than letting it degrade performance
Solution Approach 2:
The patent changes the electrical parameters of the shielding lid by adding ground pads and via holes that modify the resonance characteristics. By adjusting the position, size, and distribution of these ground elements, the resonance frequency is shifted from the problematic 2.4GHz-5.8GHz range to other frequencies, thereby changing the electrical behavior of the shielding structure to eliminate harmful enhanced peaks
2Productivity
If the shielding lid structure is modified to reduce cavity resonance, then EMI shielding test yield improves, but device complexity increases
Solution Approach 1:
The patent segments the shielding lid structure by dividing it into functional zones: the main hollow shielding body and additional ground pads with via holes. This segmentation allows independent optimization of each component - the hollow structure provides basic shielding while the segmented ground pads address resonance issues, making the overall solution more manageable and effective
Solution Approach 2:
The patent introduces ground pads and via holes as intermediary elements between the shielding lid and the substrate. These intermediaries serve as transition zones that manage electromagnetic energy by providing controlled grounding paths, effectively mediating between the hollow shielding structure and the rest of the device to reduce cavity resonance without requiring complete structural redesign
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The auxiliary ground pathway effectively adjusts the cavity resonance characteristics, shifting the enhanced peak out of the regulated frequency range, thereby enhancing the yield of EMI shielding tests and maintaining compliance with international standards.
Implementation Method 1
the hollow structure of the shielding lid 15 affected by the electromagnetic waves inevitably causes the effect of cavity resonance
Implementation Method 2
the electromagnetic waves will be restricted by the EMI shielding lid, so as to prevent the electromagnetic waves from externally transmitting
Data Source
AI summary
A package structure for a wireless communication module is disclosed and includes: a substrate having an upper surface defining a supporting region, an annular ground pad surrounding the supporting region, and at least one auxiliary ground pad formed in the supporting region; at least one chip mounted on the supporting region and electrically connected to the substrate; and a shielding lid having a receiving space for receiving the chip, a ground end surface electrically connected to the annular ground pad of the substrate, and at least one auxiliary ground portion electrically connected to the auxiliary ground pad for forming at least one auxiliary ground pathway to adjust the characteristic of the enhanced peak generated by the cavity-resonance effect of the shielding lid. Thus, the enhanced peak can be shifted out of a regulated frequency range of the EMI shielding test, so that the yield thereof can be increased.