Wireless Charging Pad Airflow Structure for Dual-Side Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wireless charging technologies face inefficiencies in managing heat dissipation, leading to overheating of both the charging device and mobile devices, which accelerates wear and tear and shortens operational life.
Innovation Solution
A wireless charging device with an integrated heat dissipation structure that includes a housing with a fan, intake grille, exhaust assembly, airflow divider, and airflow channel, directing airflow to both the heat sinks and mobile devices for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation mechanisms (heat sinks and cooling fans) are incorporated into the wireless charging device, then heat dissipation capability is improved, but under high-power charging conditions the heat generation rate exceeds dissipation capacity causing both charging device and mobile device to overheat
Solution Approach 1:
The airflow generated by the fan is divided into two separate streams through the airflow divider: one stream directed toward the heat sink and another toward the mobile device. This segmentation allows independent optimization of cooling for each component, ensuring that both the charging device and mobile device receive adequate cooling even under high-power conditions.
Solution Approach 2:
The airflow divider acts as an intermediary component that receives airflow from the fan and distributes it to two different targets (heat sink and mobile device). This mediator structure enables efficient heat dissipation from both sources simultaneously, resolving the contradiction between heat generation and dissipation capacity.
2Temperature
If additional cooling measures (such as fans) are integrated into the mobile device to cool the receiving coil and battery, then heat dissipation is improved, but device complexity and wear and tear increase
Solution Approach 1:
The cooling systems of the wireless charging device and mobile device are merged into a unified thermal management approach. The airflow from the charging device's fan directly cools both the heat sink and the mobile device, eliminating the need for separate, complex cooling systems in the mobile device and reducing overall system complexity.
Solution Approach 2:
The fan in the wireless charging device serves multiple functions: it cools both the heat sink (part of the charging device) and the mobile device simultaneously. This multi-functionality reduces the need for additional dedicated cooling components in the mobile device, thereby reducing complexity and potential wear.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves robust airflow circulation and superior thermal management, effectively cooling both the charging device and mobile devices, enhancing heat dissipation efficiency and reducing overheating risks.
Implementation Method 1
A fan is positioned within the housing in alignment with the intake grille
Implementation Method 2
the heat sink positioned on one side of the wireless charging coil module
Data Source
AI summary
A wireless charging device with a heat dissipation structure comprises a first housing and a second housing that are mutually combined. The first housing includes at least one charging pad, at least one intake grille, and at least one exhaust assembly. The at least one charging pad protrudes from an outer surface of the first housing and incorporates a heat sink for dissipating thermal energy generated during operation. A fan is positioned between the first housing and the second housing and generates an airflow into the interior of the housing. The airflow is then directed through an airflow channel toward the exhaust assembly of the first housing and an air discharge zone of the second housing. This configuration enables simultaneous cooling of the heat sink and a mobile device, achieving efficient heat dissipation.


