Wireless Power Transmission for Electrolytic Plating Substrate Holder
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Solution Overview
Problem
The existing electrolytic plating apparatuses for semiconductor devices face issues with electric contact deformation or breakage due to excessive force and fatigue, leading to high costs and potential plating failures, as the thin metal plates used for contacts are prone to damage during repetitive use.
Innovation Solution
An electrolytic plating apparatus that establishes an electric connection between the power supply and the substrate without physical contact using a wireless electric-power transmitter and receiver, comprising a DC-RF converter and electric-power coils, allowing for contactless power transmission and reducing the need for physical electric contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thin metal plates are used for electric contacts to enable electrical connection, then electrical conductivity is improved, but the contacts become prone to deformation and breakage due to excessive force and fatigue
Solution Approach 1:
The patent replaces the mechanical contact system (thin metal plates physically touching) with an inductive coupling system using coils. The transmitter coil generates a magnetic field that induces current in the receiver coil, eliminating mechanical contact while maintaining electrical connection functionality. This resolves the contradiction by removing the mechanical stress that caused deformation and breakage.
Solution Approach 2:
The patent introduces magnetic fields as an intermediary between the power supply and substrate holder. Instead of direct physical contact, energy and electrical connection are transmitted through the magnetic field generated by the transmitter coil and received by the receiver coil. This intermediary approach eliminates the need for fragile metal plate contacts.
2Reliability
If thin metal plates are used for electric contacts, then electrical connection is achieved, but the contacts are expensive due to gold plating requirements
Solution Approach 1:
By replacing the gold-plated metal plate contacts with an inductive coupling system using coils, the patent eliminates the need for expensive gold plating. The coils can be manufactured from standard conductive materials, significantly reducing material costs while maintaining reliable electrical connection functionality.
Solution Approach 2:
The coil-based system uses inexpensive conductive materials instead of expensive gold-plated metals. While the coils may have limited lifespan, their low material cost makes them economically advantageous compared to expensive gold-plated contacts that require maintenance and replacement.
3Reliability
If physical electric contacts are used, then electrical connection is established, but the substrate holder requires frequent maintenance and replacement due to contact fatigue
Solution Approach 1:
The patent replaces the mechanical contact system with an inductive coupling system, eliminating wear and fatigue issues associated with physical contacts. The coils have no moving parts or contact surfaces that degrade over time, significantly extending the substrate holder's operational lifespan and reducing maintenance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution eliminates the risk of contact failure and extends the lifespan of the substrate holder by enabling reliable voltage application to the substrate without physical contact, thereby reducing maintenance and operational costs.
Implementation Method 1
a wireless electric-power transmitter coupled to the power supply; and a wireless electric-power receiver mounted to the substrate holder and electrically connected to the electric contact
Data Source
AI summary
An electrolytic plating apparatus capable of establishing electric connection between a power supply and a substrate without physical contact is disclosed. The electrolytic plating apparatus includes: a plating tank configured to hold a plating solution therein; an anode disposed in the plating tank; a substrate holder having an electric contact arranged to be able to contact a substrate; a power supply coupled to the anode; a wireless electric-power transmitter coupled to the power supply; and a wireless electric-power receiver mounted to the substrate holder and electrically connected to the electric contact.


