Wireless Power Receiving Circuit Module With Layered Substrate
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Solution Overview
Problem
The existing IC cards with biometric authentication functions suffer from low wireless power-receiving efficiency due to weak magnetic field coupling between the loop antenna for power reception and external loop antennas, leading to adverse electromagnetic interference affecting electronic components like IC chips.
Innovation Solution
A wireless power receiving circuit module is designed with a first base, a second base, and an electronic component, featuring a wireless power receiving coil and plane ground conductor patterns. The coil is electrically connected to the circuit conductor pattern, and the ground conductor patterns act as both electric field shields and magnetic coupling enhancers, improving power reception efficiency while minimizing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a loop antenna for power reception is built in the IC card body and overlapped with the IC chip, then the IC chip can be powered wirelessly, but magnetic field coupling with external loop antennas is weak and wireless power receiving efficiency is low
Solution Approach 1:
The substrate is divided into multiple layers (first substrate layer, second substrate layer, third substrate layer) with the wireless power receiving coil placed in the second substrate layer, separating the power reception function from the IC chip mounting area to reduce interference while maintaining efficient magnetic coupling
Solution Approach 2:
Ground conductor patterns are strategically placed on specific surfaces of the first substrate layer to provide localized electromagnetic shielding for the IC chip and circuit conductor patterns, reducing interference in critical areas while maintaining overall system performance
2Volume of moving object
If the loop antenna for power reception is placed close to the IC chip for compact design, then the device size is reduced, but electromagnetic interference adversely affects electronic components
Solution Approach 1:
The problem of spatial interference is solved by transitioning from a two-dimensional planar arrangement to a three-dimensional layered structure, allowing the wireless power receiving coil, IC chip, and ground conductor patterns to be arranged in different layers with vertical separation, thus reducing electromagnetic interference while maintaining compact overall dimensions
Solution Approach 2:
Ground conductor patterns serve as intermediary electromagnetic shields between the wireless power receiving coil and the IC chip, absorbing or redirecting electromagnetic interference while allowing the components to remain in close proximity for compact design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances power-receiving efficiency and suppresses electromagnetic interference in electronic components, ensuring reliable operation of IC chips and other sensitive components.
Implementation Method 1
the wireless power receiving coil produces magnetic coupling by interlinking a magnetic flux with a magnetic field from the outside
Implementation Method 2
The first plane ground conductor pattern acts as an electric field shield that protects the circuit conductor pattern formed in the first base against an electric field from an outside
Data Source
AI summary
A wireless power receiving circuit module includes a first base, a second base, electronic components, a power receiving coil, and a ground conductor pattern. The number of layers of the second base is different from that of the first base, and the second base does not overlap with the first base in a plan view and shares a predetermined dielectric layer with the first base. The electronic components are mounted on a first main surface of the first base. The power receiving coil is formed in the second base. The ground conductor pattern is disposed on a second main surface side in the first base and overlaps with the electronic components.