Wireless Probe Card Using COF Antennas for Pad Protection

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Solution Overview

Problem

The challenge in semiconductor device testing is the potential damage to small, reduced-size chip pads due to probe contact during electrical property testing, and the difficulty in efficiently transmitting signals to and from miniature reception antennas on semiconductor devices.

Innovation Solution

A probe card with chip-on-film (COF) type transmission antennas and a distance adjusting unit is used to wirelessly transmit electrical power and data signals to semiconductor devices, reducing the need for direct probe contact and minimizing damage to chip pads, while ensuring efficient signal transmission through a substrate with a tape wiring substrate and coil configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If probe contact is used for electrical property testing, then signal transmission is achieved, but chip pad damage occurs

Engineering Contradiction:

Improvetesting reliabilityVSAvoidchip pad damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical probe contact system with a wireless electromagnetic field-based signal transmission system. Transmission antennas on the probe card generate electromagnetic fields that couple with reception antennas on the semiconductor devices, eliminating mechanical contact and the associated chip pad damage while maintaining testing reliability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces electromagnetic fields as an intermediary medium for signal transmission between the probe card and semiconductor devices. Instead of direct mechanical contact, signals are transmitted through electromagnetic coupling between transmission and reception antennas, serving as a non-contact intermediary that eliminates mechanical damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If wireless transmission is implemented, then chip pad damage is reduced, but device complexity increases

Engineering Contradiction:

Improvechip pad damageVSAvoidprobe card structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The probe card is designed with multi-functionality by integrating both wired probe contacts and wireless transmission antennas into a single device. This allows the probe card to perform both traditional contact-based testing and wireless signal transmission, reducing the need for separate testing equipment and offsetting the added complexity through consolidated functionality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The wireless transmission function is segmented into separate transmission antennas that can be independently configured and positioned on the probe card. This modular approach allows the complex wireless functionality to be divided into manageable components, each performing a specific function, which simplifies the overall design and integration process.

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If reception antennas are added to semiconductor devices, then wireless signal reception is enabled, but manufacturing precision requirements increase

Engineering Contradiction:

Improvesignal transmission capabilityVSAvoidantenna positioning

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent employs parameter changes in the antenna design, including optimizing antenna size, shape, and electrical characteristics to achieve effective wireless communication. By adjusting these parameters, the system can accommodate variations in positioning and reduce the stringency of manufacturing precision requirements while maintaining signal transmission capability.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for simultaneous wired and wireless testing, reducing the risk of chip pad damage and enabling effective signal transmission to and from miniature reception antennas, even on densely packed semiconductor devices, thereby improving testing efficiency and accuracy.

Implementation Method 1

at least one transmission antenna, which is implemented as a chip on film (COF) type and attached to the substrate. The at least one transmission antenna wirelessly transmits at least one of an electrical power signal and a data signal to each of the semiconductor devices.

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS9835681B2Probe card including wireless interface and test system including the same

Publication Date: 2017.12.05 SAMSUNG ELECTRONICS CO LTD

AI summary

A probe card for testing electrical properties of a device under test (DUT) includes a plurality of semiconductor devices, which includes a substrate; and at least one transmission antenna, which is implemented as a chip on film (COF) type and attached to the substrate, wirelessly transmitting at least one of electric power and data to each of the plurality of semiconductor devices.