Wireless Probing System for High-Speed IC Testing

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Solution Overview

Problem

Conventional automatic test equipment (ATE) struggles to accurately probe the electrical properties of high-speed integrated circuit devices due to mechanical limitations, which cannot keep pace with the increasing operation speed of these devices.

Innovation Solution

A wireless probing system for integrated circuit devices that uses a first transceiving module in the testing machine and a second transceiving module in the device under test, enabling the transmission of testing data such as probing signals and electrical parameters between the two in a wireless manner, thereby eliminating the need for mechanical contact and allowing for faster data exchange.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If mechanical probe tips are used to contact signal pads for transmitting probing signals, then the testing process can be performed, but the overall time accuracy cannot catch up with the high-speed operation of the integrated circuit device

Engineering Contradiction:

Improveoverall time accuracyVSAvoidoperation speed of integrated circuit device

Core Design Contradiction:

Measurement precisionVSSpeed

Solution Approach 1:

The patent replaces the mechanical probe tip contact system with a wireless communication system. The testing machine includes a first transceiving module that wirelessly transmits probing signals to the device under test, and the device under test includes a second transceiving module that receives these signals and transmits tested electrical parameters back to the testing machine. This substitution of mechanical contact with wireless communication eliminates the mechanical limitations that prevented keeping up with high-speed device operation, thereby resolving the contradiction between measurement precision and device speed.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If conventional automatic test equipment uses mechanical probing, then the testing process can be completed, but the testing efficiency cannot keep pace with the increasing operation speed of high-speed integrated circuit devices

Engineering Contradiction:

Improvetesting efficiencyVSAvoidoperation speed of integrated circuit device

Core Design Contradiction:

ProductivityVSSpeed

Solution Approach 1:

The patent replaces the mechanical probing system with a wireless communication-based testing system. The first transceiving module in the testing machine and the second transceiving module in the device under test enable rapid data exchange without mechanical contact limitations. This allows the testing efficiency to keep pace with the increasing operation speed of high-speed integrated circuit devices, resolving the contradiction between productivity and device speed.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If probe tips are used to form a path for transmitting probing signals, then electrical properties can be tested, but the system complexity increases due to mechanical contact requirements

Engineering Contradiction:

Improveelectrical property testingVSAvoidmechanical contact system

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical probe tip contact system with a wireless communication system consisting of transceiving modules. This substitution simplifies the system by eliminating mechanical contact requirements while maintaining the ability to test electrical properties reliably. The first transceiving module in the testing machine and the second transceiving module in the device under test provide a cleaner, more reliable signal transmission path without the complexity of mechanical probing systems.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables the accurate and efficient testing of high-speed integrated circuit devices by matching the overall time accuracy with the device's operation speed, allowing for the diagnosis of failure causes and selection of devices meeting electrical specifications, while improving testing efficiency.

Implementation Method 1

a first transceiving module (22) and an integrated circuit device (30) being tested by the testing machine (20), in which testing data such as the probing signal and the tested electrical parameter etc. is transmitted between the testing machine (20) and the integrated circuit device (30) in a wireless manner

Methodology Applied

Scientific EffectWireless transmission: Electromagnetic Induction

Data Source

PatentUS7904768B2Probing system for integrated circuit devices

Publication Date: 2011.03.08 NATIONAL TSING HUA UNIVERSITY

AI summary

A probing system for an integrated circuit device, which transmits a testing data/signal between an automatic test equipment (ATE) and an integrated circuit device, is disclosed. The probing system includes a test head having a first transceiving module. There is a test station having a test unit coupled to the test head to perform a test operation. A communication module has a second transceiving module configured to exchange data with the first transceiving module in a wireless manner. There is an integrated circuit device having a core circuit being tested, and a test module having a self-test circuit coupled to the core circuit and the communication module for performing the core circuit self-testing.